參數(shù)資料
型號(hào): TE28F016B3T150
廠商: INTEL CORP
元件分類: DRAM
英文描述: SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE
中文描述: 2M X 8 FLASH 3V PROM, 150 ns, PDSO40
封裝: 10 X 20 MM, TSOP-40
文件頁數(shù): 7/49頁
文件大?。?/td> 408K
代理商: TE28F016B3T150
E
2.1
SMART 3 ADVANCED BOOT BLOCK
–BYTE-WIDE
7
PRELIMINARY
Package Pinouts
The Smart 3 Advanced Boot Block flash memory is
available in 40-lead TSOP (see Figure 1) and 48-
ball
μ
BGA packages (see Figures 2 and 3). In
Figure 1, pin changes from one density to the next
are circled. Both packages, 40-lead TSOP and 48-
ball
μ
BGA
package, are 8-bits wide and fully
upgradeable across product densities (from 8 Mb to
16 Mb).
Advanced Boot Block
40-Lead TSOP
10 mm x 20 mm
TOP VIEW
25
24
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
20
19
17
18
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
21
22
23
28F008
28F016
A
16
A
15
A
14
A
13
A
12
A
11
A
9
A
8
WE#
RP#
V
WP#
A
18
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
16
A
15
A
14
A
13
A
12
A
11
A
9
A
8
WE#
RP#
V
WP#
A
18
A
7
A
6
A
5
A
4
A
3
A
2
A
1
28F008
28F016
A
17
GND
NC
A
19
A
10
DQ
7
DQ
6
DQ
5
DQ
4
V
CCQ
V
CC
NC
DQ
3
DQ
2
DQ
1
DQ
0
OE#
GND
CE#
A
0
A
17
GND
A
20
A
10
DQ
7
DQ
6
DQ
5
DQ
4
V
CCQ
V
CC
NC
DQ
3
DQ
2
DQ
1
DQ
0
OE#
GND
CE#
A
0
A
19
0605-01
Figure 1. 40-Lead TSOP Package
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