參數(shù)資料
型號: TE28F008B3B110
廠商: INTEL CORP
元件分類: DRAM
英文描述: SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
中文描述: 1M X 8 FLASH 2.7V PROM, 110 ns, PDSO40
封裝: 10 X 20 MM, TSOP-40
文件頁數(shù): 9/48頁
文件大?。?/td> 304K
代理商: TE28F008B3B110
E
SMART 3 ADVANCED BOOT BLOCK
9
PRELIMINARY
A
13
A
14
A
15
A
16
V
CCQ
A
11
A
10
A
12
D
14
D
15
A
8
WE#
A
9
D
5
D
6
V
PP
RP#
D
11
D
12
WP#
A
18
A
20
D
2
D
3
A
19
A
17
A
6
D
8
D
9
A
7
A
5
A
3
CE#
D
0
A
4
A
2
A
1
A
0
GND
GND
D
7
D
13
D
4
V
CC
D
10
D
1
OE#
A
B
C
D
E
F
1
3
5
4
7
6
8
16M
32M
8M
0580_03
NOTES:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A
19
is the upgrade address for the 16-Mbit device. A
20
is the
upgrade address for the 32-Mbit device.
4-Mbit density not available in
μ
BGA* CSP.
Figure 4. x16 48-Ball
μ
BGA* Chip Size Package (Top View, Ball Down)
2.
相關(guān)PDF資料
PDF描述
TE28F008B3B90 SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
TE28F008B3BA110 SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
TE28F008B3BA90 SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
TE28F008B3T110 SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
TE28F008B3T90 SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY
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