參數(shù)資料
型號： TDA9897HN/V3
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQCC48
封裝： 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, MS-026, SOT619-1, HVQFN-48
文件頁數(shù)： 102/103頁
文件大?。?/td> 529K
代理商： TDA9897HN/V3
TDA9897_TDA9898_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 25 May 2009
98 of 103
NXP Semiconductors
TDA9897; TDA9898
Multistandard hybrid IF processing
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 54) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 58 and 59
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 54.
Table 58.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 59.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA9897S1 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing
TDA9897V2 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing
TDA9898 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing
TDA9898HL 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard hybrid IF processing
TDA9898HL/V2/S1,11 功能描述:上下轉(zhuǎn)換器 MULTI APPL SYS RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128
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