參數(shù)資料
型號: TDA8944AJ
廠商: NXP SEMICONDUCTORS
元件分類: 音頻/視頻放大
英文描述: 7 W, 2 CHANNEL, AUDIO AMPLIFIER, PZIP17
封裝: PLASTIC, DIL-BENT-SIL, 17 PIN
文件頁數(shù): 7/20頁
文件大?。?/td> 376K
代理商: TDA8944AJ
Philips Semiconductors
TDA8944AJ
2 x 7 W BTL audio amplier with DC gain control
Product data
Rev. 01 — 01 March 2002
15 of 20
9397 750 09433
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
14.1.2
Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR - typical 100 nF - has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor - e.g. 1000
F or greater - must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
14.2 Thermal behaviour and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb) is 4.5 K/W.
A calculation for the heatsink can be made, with the following parameters:
Tamb =50 °C
VCC = 12 V and RL =8
Tj(max) = 150 °C
Rth(tot) is the total thermal resistance between the junction and the ambient
including the heatsink. In the heatsink calculations the value of Rth(mb-h) is ignored.
Fig 16. Printed-circuit board layout (single-sided); components view.
MGW607
100 nF
220
nF
220 nF
4.7
nF
1
4.7
nF
1000
F
10
F
4
4
4
4
OUT1
IN2
IN2
+
IN1
IN1
+
OUT1
+
OUT2
OUT2
+
GC
SGND
GND
VCC
ON
MODE
SVR
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