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參數(shù)資料
| 型號： | TDA8787A |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 10-bit, 3.0 V, up to 25 Msps analog-to-digital interface for CCD cameras |
| 中文描述： | 10位，為3.0 V，高達25 Msps的模擬到數(shù)字的CCD相機接口 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 125K |
| 代理商： | TDA8787A |
2000 Nov 14
21
Philips Semiconductors
Product specification
10-bit, 3.0 V, up to 25 Msps analog-to-digital
interface for CCD cameras
TDA8787A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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PDF描述 |
|---|---|
| TDA8787 | 10-bit, 3.0 V analog-to-digital interface for CCD cameras |
| TDA8790 | 8-bit, 40 Msps 2.7 to 5.5 V universal analog-to-digital converter |
| TDA8792 | 3.3 V, 25 MHz 8-bit analog-to-digital converter ADC |
| TDA8793HL | 8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter ADC |
| TDA8798 | Dual 8-bit, 100 Msps A/D converter with DPGA |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TDA8787AHL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:10-bit, 3.0 V, up to 25 Msps analog-to-digital interface for CCD cameras |
| TDA8787AHL/C3,118 | 功能描述:電信線路管理 IC 10-BIT CCD 25MSPS RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| TDA8787AHL/C3,151 | 功能描述:電信線路管理 IC ADC 10BIT 18MSPS RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| TDA8787AHL/C3,157 | 功能描述:模數(shù)轉換器 - ADC AFE Video 1ADC 10Bit 2.6V/3V 48-Pin RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| TDA8787AHL/S1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:10-bit, 3.0 V, up to 25 Msps analog-to-digital interface for CCD cameras |
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