參數(shù)資料
型號(hào)： TDA8754HL/25
廠商： NXP SEMICONDUCTORS
元件分類： ADC
英文描述： 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, LOW PROFILE, PLASTIC, SOT-486-1, QFP-144
文件頁(yè)數(shù)： 50/57頁(yè)
文件大?。?/td> 251K
代理商： TDA8754HL/25
2003 Sep 30
54
Philips Semiconductors
Preliminary specication
Triple 8-bit video ADC up to 270 Msps
TDA8754
16.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended(7)
suitable
PMFP(8)
not suitable
相關(guān)PDF資料
PDF描述
TDA8755-T 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PDSO32
TDA8755TD-T 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PDSO32
TDA8755TD 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PDSO32
TDA8757AHL/17 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
TDA8757AHL/21 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA8754HL27BE-S 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 3X8 BIT VIDEO A/D-270 MSPS RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
TDA8755 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:YUV 8-bit video low-power analog-to-digital interface
TDA8755T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:YUV 8-bit video low-power analog-to-digital interface
TDA8755TD-T 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TV/Video Signal Processor
TDA8757 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triple 8-bit ADC 170 Msps
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