參數(shù)資料
型號(hào)： TDA8552
廠商： NXP Semiconductors N.V.
元件分類(lèi)： 運(yùn)動(dòng)控制電子
英文描述： 2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
中文描述： 2 × 1.4 W功率，橋接與數(shù)字音量控制和傳感耳機(jī)音頻放大器
文件頁(yè)數(shù)： 15/28頁(yè)
文件大小： 254K
代理商： TDA8552
1998 Jun 02
15
Philips Semiconductors
Preliminary specification
2
×
1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
TDA8552T; TDA8552TS
Test conditions
T
amb
= 25
°
C if not specially mentioned; V
DD
= 5 V;
f = 1 kHz, R
L
= 8
, G
v
= 20 dB, audio band-pass
22 Hz to 22 kHz. The thermal resistance (in standard print,
without extra copper) = 110 K/W for the SSOP20; the
maximum sine wave power dissipation is:
25
–
110
For T
amb
= 60
°
C the maximum total power dissipation is:
60
–
110
Thermal design considerations
The ‘measured’ thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. All surface mount packages rely on the
traces of the PCB to conduct heat away from the package.
To improve the heat flow, a significant area on the PCB
must be attached to the (ground) pins. Data may not be
comparable between different semiconductor
manufacturers because the application boards and test
methods are not (yet) standardized. Also, the thermal
performance of packages for a specific application may be
different than presented here, because the configuration of
the application boards (copper area) may be different.
Philips Semiconductors uses FR-4 type application boards
with 1 oz copper traces with solder coating Solder Resist
Mask (SRM).
The SSOP20 package has improved thermal conductivity
which reduces the thermal resistance. Using a practical
PCB layout (see Fig.18) with wider copper tracks to the
corner pins and just under the IC, the thermal resistance
from junction to ambient can be reduced to approximately
80 K/W. For T
amb
= 60
°
C the maximum total power
dissipation for this PCB layout is:
The thermal resistance for the SO20 is approximately
55 K/W if applied to a PCB with wider copper tracks to the
corner pins and just under the body of the IC.
The maximum total power dissipation for this practical
application is:
150
1.14 W
=
150
0.82 W
=
150
60
–
80
1.12 W
=
150
60
–
55
1.63 W
=
BTL application
The BTL application diagram is illustrated in Fig.4.
The quiescent current has been measured without any
load impedance. The total harmonic distortion as a
function of frequency was measured with a low-pass filter
of 80 kHz. The value of capacitor C3 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C3 increases the performance of the SVRR.
Headphone application
T
amb
= 25
°
C if not specially mentioned, V
DD
= 5 V,
f = 1 kHz, R
L
= 32
, G
v
= 14 dB, audio band-pass
22 Hz to 22 kHz.
For headphone application diagram see: Fig.4
If a headphone is plugged into the headphone jack, the
HPS pin will switch-off the outputs of the SLAVE output
stage, this results in a mute attenuation >80 dB for the
loudspeakers. In this condition the quiescent current will
be reduced.
General remarks
Reduction of the value of capacitor C3 results in a
decrease of the SVRR performance at low frequencies.
The capacitor value of C5 and C6 in combination with the
load impedance of the headphone determines the low
frequency behaviour.
To prevent against high output currents during inserting
the headphone into the headphone jack, resistors of 5.1
have to be connected in series with the SE output lines.
The UP/DOWN pin can be driven by a 3-state logic output
stage (microprocessor) without extra external
components. If the UP/DOWN pin is driven by
push-buttons, then it is advised to have an RC-filter
between the buttons and the UP/DOWN pin. Advised
values for the RC-filter are 2.2 k
and 100 nF. Resistor R4
is not necessary for basic operation, but is advised to
keep C6 charged to a voltage of 0.5V
DD
This has the
advantage that the plop noise when inserting the
headphone plug is minimal. If the headphone sense
function (HPS) is not used then the HPS-pin 4 should be
hard-wired to ground. This pin should never be left
unconnected.
Using double push buttons, the volume step for both
channels can be controlled. When for the balance control
only a single contact is used, the balance steps are
1.25 dB. If double contacts are used for the balance
buttons and the dashed connection is made, then the
balance steps are 2.5 dB.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA8552T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T/N1,512 功能描述:音頻放大器 AUDIO PWR AMP BTL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8552T/N1,518 功能描述:音頻放大器 2X1W CMOS AMP + VOL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8552T/N1.112 制造商:NXP Semiconductors 功能描述:AMP AUDIO POWER DUAL 8552 SOIC20
TDA8552T_02 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
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