參數(shù)資料
型號(hào): TDA8310
廠商: NXP SEMICONDUCTORS
元件分類: 消費(fèi)家電
英文描述: PAL/NTSC colour processor for PIP applications
中文描述: SPECIALTY CONSUMER CIRCUIT, PDIP52
封裝: PLASTIC, SOT-247-1, SDIP-52
文件頁數(shù): 21/24頁
文件大?。?/td> 92K
代理商: TDA8310
February 1995
21
Philips Semiconductors
Preliminary specification
PAL/NTSC colour processor for
PIP applications
TDA8310
PACKAGE OUTLINE
Fig.4 Plastic shrink dual in-line package; 52 leads; 600 mil (SDIP52, SOT247-1).
Dimensions in mm.
handbook, full pagewidth
s
1
27
26
1.3 max
14.1
13.7
47.92
47.02
4.57
max
5.08
max
0.51
min
3.2
2.8
0.18
M
0.53
max
1.778
(25x)
1.73
max
15.80
15.24
0.32 max
15.24
17.15
15.90
MSA267
52
SOLDERING
Plastic dual in-line packages
B
Y DIP OR WAVE
The maximum permissible temperature of the solder is
260
°
C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300
°
C, it must not be in contact for more than 10 s;
if between 300 and 400
°
C, for not more than 5 s.
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