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參數(shù)資料
| 型號(hào)： | TDA3653B/N2,112 |
| 廠商： | NXP Semiconductors |
| 文件頁(yè)數(shù)： | 5/13頁(yè) |
| 文件大小： | 0K |
| 描述： | IC VERT DEFLECT 9-SIL |
| 標(biāo)準(zhǔn)包裝： | 22 |
| 系列： | * |
| 類(lèi)型： | * |
| 應(yīng)用： | * |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 9-SIP 裸露接片 |
| 供應(yīng)商設(shè)備封裝： | 9-SIL MPF |
| 包裝： | 管件 |
| 其它名稱(chēng)： | 935084350112 TDA3653BU TDA3653BU-ND |
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March 1991
13
Philips Semiconductors
Product specication
Vertical deection and guard circuit (90)
TDA3653B
TDA3653C
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specication
This data sheet contains target or goal specications for product development.
Preliminary specication
This data sheet contains preliminary data; supplementary data may be published later.
Product specication
This data sheet contains nal product specications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specication
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specication.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA3653BU | 功能描述:視頻 IC VERTICLE OUTPUT RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
| TDA3653C | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Vertical deflection and guard circuit 90° |
| TDA3654 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Vertical deflection and guard circuit 110∑ |
| TDA3654Q | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Vertical deflection and guard circuit 110° |
| TDA3661 | 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Very low dropout voltage/quiescent current adjustable voltage regulator |
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