參數(shù)資料
型號(hào)： TDA19977BHV/15/C1
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, SOT612-3, HLQFP-144
文件頁數(shù)： 27/40頁
文件大?。?/td> 181K
代理商： TDA19977BHV/15/C1
TDA19977A_TDA19977B_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 August 2008
33 of 40
NXP Semiconductors
TDA19977A; TDA19977B
Triple input HDMI receiver interface with digital processing
17.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 18 and 19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 9.
Table 18.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 19.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料
PDF描述
TDA2003-TA5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, SFM5
TDA2003-TB5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, ZFM5
TDA2003G-TA5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, SFM5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA19978A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad HDMI 1.3a receiver interface with equalizer (HDTV up to 1080p, up to UXGA for PC formats)
TDA19978AHV 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad HDMI 1.3a receiver interface with equalizer (HDTV up to 1080p, up to UXGA for PC formats)
TDA19978AHV/15,518 功能描述:視頻 IC IC SMART CARD INTF RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
TDA19978AHV/15,551 制造商:NXP Semiconductors 功能描述:TDA19978AHV/HLQFP144/TRAYBDP//15/C182 - Trays
TDA19978AHV/15,557 功能描述:視頻 IC IC SMART CARD INTF RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
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