
TC2575
1.0A Step-Down Switching Regulator
16
TC2575-1 3/13/00
2001 Microchip Technology Inc.
DS21398A
Thermal Analysis and Design
The following procedure must be performed to deter-
mine whether or not a heatsink will be required. First
determine:
1. PD (max) – maximum regulator power dissipation in the
application.
2. TA (max) – maximum ambient temperature in the
application.
3. TJ (max) – maximum allowed junction temperature
(125
°C for the TC2575). For a conservative design, the
maximum junction temperature should not exceed 110
°C
to assure safe operation. For every additional 10
°C tem-
perature rise that the junction must withstand, the estimated
operating lifetime of the component is halved.
4.
ΘJC – package thermal resistance junction–case.
5.
ΘJA – package thermal resistance junction–
ambient.
(Refer to Absolute Maximum Ratings on this data sheet
or
ΘJC and ΘJA values).
The following formula is to calculate the approximate
total power dissipated by the TC2575:
PD = (VIN x IQ ) + d x ILOAD x VSAT
where d is the duty cycle and for buck converter
d =
tON
=
VOUT
T
VIN
IQ (quiescent current) and VSAT can be found in the
TC2575 data sheet,
VIN is minimum input voltage applied,
VOUT is the regulator output voltage,
ILOAD is the load current.
The dynamic switching losses during turn–on and turn–
off can be neglected if a proper type catch diode is used.
Packages (Free–Standing)
For a free–standing application when no heatsink is
used, the junction temperature can be determined by the
following expression:
TJ = (ΘJA ) (PD ) + TA
where (
ΘJA )(PD ) represents the junction temperature
rise caused by the dissipated power and TA is the maxi-
mum ambient temperature.
Some Aspects That can Influence
Thermal Design
It should be noted that the package thermal resistance
and the junction temperature rise numbers are all approxi-
mate, and there are many factors that will affect these
numbers, such as PC board size, shape, thickness, physical
position, location, board temperature, as well as whether the
surrounding air is moving or still.
Other factors are trace width, total printed circuit copper
area, copper thickness, single– or double–sided, multilayer
board, the amount of solder on the board or even color of the
traces.
The size, quantity and spacing of other components on
the board can also influence its effectiveness to dissipate
the heat.
Figure 8. Inverting Buck-Boost Regulator Using the TC2575 (12V)
Develops –12V @ 0.35A
D1
1N5822
L1
68
H
Output
GND
2
5
4
Feedback
12 to 40V
Unregulated
DC Input
1
3
R247k
ON/OFF
+VIN
–12V @ 700A
Regulated
Output
TC2576
(12V)
COUT
2200
F
CIN
100
F
/50V