參數(shù)資料
型號(hào): TAS5121A
廠商: Texas Instruments, Inc.
英文描述: DIGITAL AMPLIFIER POWER STAGE
中文描述: 數(shù)字放大器功率級(jí)
文件頁(yè)數(shù): 15/21頁(yè)
文件大?。?/td> 405K
代理商: TAS5121A
SLES094A - OCTOBER 2003 - REVISED MARCH 2004
www.ti.com
15
Heatsink thermal resistance is generally predicted by the
heatsink vendor, modeled using a continuous flow
dynamics (CFD) model, or measured.
Thus, for a single monaural IC, the system R
θ
JA
= R
θ
JC
+
thermal grease resistance + heatsink resistance.
Table 4, Table 5, and Table 6 indicate modeled
parameters for one or two TAS5112A ICs on a single
heatsink. The final junction temperature is set at 110
°
C in
all cases. It is assumed that the thermal grease is 0.002
inch thick and that it is similar in performance to Wakefield
Type 126 thermal grease. It is important that the thermal
grease layer is
0.002 inches thick and that thermal pads
or tape are not used in the pad-to-heatsink interface due
to the high power density that results in these extreme
power cases.
Table 4. Case 1 (2
×
50 W Unclipped Into 6
,
Both Channels in Same IC)
(1)
56-Pin HTSSOP
25
°
C
50 W (unclipped)
Ambient temperature
Power to load (per channel)
Power dissipation
4.5 W
10.2
°
C, note 2
×
channel dissipation
Delta T inside package
Delta T through thermal grease
37.1
°
C, note 2
×
channel dissipation
Required heatsink thermal resistance
4.2
°
C/W
110
°
C
19
°
C/W
85
°
C
85
°
C + 25
°
C = 110
°
C
Junction temperature
System R
θ
JA
R
θ
JA * power dissipation
Junction temperature
(1)This case represents a stereo system with only one package. See
Case 2 and Case 2A if doing a full-power, 2-channel test in a
multichannel system.
Table 5. Case 2 (2
×
50 W Unclipped Into 6
,
Channels in Separate Packages)
(1)
56-Pin HTSSOP
25
°
C
50 W (unclipped)
Ambient temperature
Power to load (per channel)
Power dissipation
4.5 W
5.1
°
C
18.6
°
C
6.9
°
C/W
110
°
C
19
°
C/W
85
°
C
85
°
C + 25
°
C = 110
°
C
Delta T inside package
Delta T through thermal grease
Required heatsink thermal resistance
Junction temperature
System R
θ
JA
R
θ
JA * power dissipation
Junction temperature
(1)In this case, the power is separated into two packages. Note that
this allows a considerably smaller heatsink because twice as much
area is available for heat transfer through the thermal grease. For
this reason, separating the stereo channels into two ICs is
recommended in full-power stereo tests made on multichannel
systems.
Table 6. Case 2A (2
×
60 W Into 6
, Channels in
Separate IC Packages)
(1)
56-Pin HTSSOP
25
°
C
60 W (10% THD)
Ambient temperature
Power to load (per channel)
Power dissipation per channel
5.4 W
6.1
°
C, note 2
×
channel dissipation
Delta T inside package
Delta T through thermal grease
22.3
°
C, note 2
×
channel dissipation
Required heatsink thermal resistance
5.3
°
C/W
110
°
C
15.9
°
C/W
85
°
C
85
°
C + 25
°
C = 110
°
C
Junction temperature
System R
θ
JA
R
θ
JA * power dissipation
Junction temperature
(1)In this case, the power is also separated into two packages, but
overdriving causes clipping to 10% THD. In this case, the high
power requires extreme care in attachment of the heatsink to
ensure that the thermal grease layer is
0.002 inches thick. Note
that this power level should not be attempted with both channels in
a single IC because of the high power density through the thermal
grease layer.
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