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參數(shù)資料
| 型號： | T6B70BFG |
| 廠商： | Toshiba Corporation |
| 英文描述： | Interface IC for Hot Water Dispensers |
| 中文描述： | 接口集成電路熱飲水機(jī) |
| 文件頁數(shù)： | 15/21頁 |
| 文件大?。?/td> | 406K |
| 代理商： | T6B70BFG |
T6B70BFG
2007-07-19
15
Toshiba CMOS SOP Embossed Taping - Common Specifications
1. Applicable Scope
This specification defines the embossed taping package specifications and related items for Toshiba flat
package CMOS ICs. As a rule, these taping specifications comply with JEITA (RC-1009B) and EIA (EIA481).
2. Specifications
2.1
Tape Form and Dimensions
Package
JEITA Tape Standard
300 mm 14, 16 pin (JEITA Type
II
)
TE1612
300 mm 20 pin (JEITA Type
II
)
TE2412
Unit: mm
A
B
W
F
E
P1
P2
P0
φ
D0
t
T1
φ
D1
14, 16
pin type
8.5
±
0.2
10.8
±
0.2
16.0
±
0.3
7.5
±
0.1
1.75
±
0.1
12.0
±
0.1
2.0
±
0.1
4.0
±
0.1
1.5
+
0.1
0
0.3
±
0.1
2.1
±
0.2
1.65
±
0.1
20
pin type
8.3
±
0.2
13.2
±
0.2
24.0
±
0.3
11.5
±
0.1
1.75
±
0.1
12.0
±
0.1
2.0
±
0.1
4.0
±
0.1
1.5
+
0.1
0
0.3
±
0.1
2.2
±
0.2
2.0
±
0.2
Note 1: The tape surface resistance shall be 10
6
Ω
/cm or less.
Note 2: The accumulated error tolerance for the feed hole pitch (P0) shall be
≤
±
0.2 mm per 10 pitches.
Y
X
X
Y
P1
P2 P0
φ
D0
φ
D1
F
W
E
Direction of feed
B
t
T1
Section view Y-Y
A
Section view X-X
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