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參數(shù)資料
型號: SY89852UMG TR
廠商: Micrel Inc
文件頁數(shù): 8/13頁
文件大?。?/td> 0K
描述: IC MUX 2:1 LVPECL DIFF LP 16-MLF
標準包裝: 1,000
系列: SY89
類型: 多路復用器
電路: 1 x 2:1
獨立電路: 1
電壓電源: 單電源
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤,16-MLF?
供應商設備封裝: 16-MLF?(3x3)
包裝: 帶卷 (TR)
其它名稱: SY89852UMGTR
SY89852UMGTR-ND
Micrel, Inc.
SY89852U
October 2008
M9999-100208-D
hbwhelp@micrel.com or (408) 955-1690
4
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ..........................–0.5V to +4.0V
Input Voltage (VIN) ..................................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ................................................. 50mA
Surge........................................................ 100mA
Termination Current
(3)
Source or sink current on VT .................... ±50mA
Lead Temperature (soldering, 20sec.) ...........+260°C
Storage Temperature (Ts)..................–65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC).................. +2.375V to +2.625V
......................................................+3.0V to +3.6V
Ambient Temperature (TA)................ –40°C to +85°C
Package Thermal Resistance
(4)
QFN (
θ
JA)
Still-Air ..................................................... 60°C/W
QFN (
ψ
JB)
Junction-to-Board .................................... 38°C/W
DC Electrical Characteristics
(5)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
2.5
2.625
V
3.0
3.3
3.6
V
ICC
Power Supply Current
No load, max. VCC
23
35
mA
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
80
100
120
RIN
Input Resistance
(IN-to-VT)
40
50
60
VIH
Input High Voltage
(IN-to-/IN)
Note 6
VCC –1.6
VCC
V
VIL
Input Low Voltage
(IN-to-/IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN-to-/IN)
See Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
V
VT_IN
IN-to-VT
(IN-to-/IN)
1.28
V
Notes:
1. Permanent device damage may occur if the “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional
operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute
maximum ratings conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θ
JA and
ψ
JB use a 4-layer board in still air, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIH (min) not lower than 1.2V.
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