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參數(shù)資料
型號: SY89843UMG TR
廠商: Micrel Inc
文件頁數(shù): 13/17頁
文件大?。?/td> 0K
描述: IC MUX CML RPE 2:1 PREC 24-MLF
標(biāo)準(zhǔn)包裝: 1,000
系列: SY89
類型: 多路復(fù)用器
電路: 1 x 2:1
獨(dú)立電路: 1
電壓電源: 單電源
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-VFQFN 裸露焊盤,24-MLF?
供應(yīng)商設(shè)備封裝: 24-MLF?(4x4)
包裝: 帶卷 (TR)
其它名稱: SY89843UMGTR
SY89843UMGTR-ND
Micrel, Inc.
SY89843U
Oct. 1, 2013
5
M9999-052207-B
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC).............................................. –0.5V to +4.0V
Input Voltage (VIN)......................................................–0.5V to VCC
LVPECL Output Current (IOUT)
Continuous .................................................................. ±50mA
Surge ........................................................................ ±100mA
Termination Current
Source/Sink Current on VT ........................................ ±100mA
Input Current
Source/sink current on IN, /IN ..................................... ±50mA
VREF-AC Current
Source/sink current on VREF-AC ...................................... ±2mA
Lead Temperature (soldering, 20 sec.) ..............................+260°C
Storage Temperature (Ts)....................................
–65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC) .............................+2.375V to +2.625V
...............................................................+3.0V to +3.6V
Ambient Temperature (TA)........................... –40°C to +85°C
Package Thermal Resistance
(3)
QFN (
JA)
Still-Air ............................................................... 50°C/W
QFN (
JB)
Junction-to-Board .............................................. 30°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C; unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
3.0
2.5
3.3
2.625
3.6
V
ICC
Power Supply Current
No load, max VCC.
70
100
mA
RIN
Input Resistance
(IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a. Note 5
0.1
VCC
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
V
VIN_FSI
Input Voltage Threshold that triggers
FSI
30
100
mV
VT_IN
IN-to-VT
(IN, /IN)
1.28
V
VREF-AC
Output Reference Voltage
VCC–1.3
VCC–1.2
VCC–1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
JA and JB
values are determined for a 4-layer board in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIN (max) is specified when VT is floating.
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