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參數(shù)資料
型號: SY89538LHZ TR
廠商: Micrel Inc
文件頁數(shù): 22/23頁
文件大?。?/td> 0K
描述: IC SYNTHESIZR LVPECL/LVDS 64TQFP
標準包裝: 1,000
系列: Precision Edge®
類型: 時鐘合成器/扇出緩沖器
PLL:
輸入: CMOS,HSTL,LVDS,LVPECL,LVTTL,SSTL,晶體
輸出: LVDS,LVPECL
電路數(shù): 1
比率 - 輸入:輸出: 3:7
差分 - 輸入:輸出: 是/是
頻率 - 最大: 756MHz
除法器/乘法器: 是/無
電源電壓: 2.375 V ~ 3.6 V
工作溫度: 0°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 64-TQFP 裸露焊盤
供應商設備封裝: 64-EP-TQFP
包裝: 帶卷 (TR)
其它名稱: SY89538LHZTR
SY89538LHZTR-ND
Micrel, Inc.
SY89538L
January 2008
M9999-010808-E
hbwhelp@micrel.com or (408) 955-1690
8
Absolute Maximum Ratings
(1)
Supply Voltage (VCCD, VCCA, VCCO)...... –0.5V to +4.0V
Input Voltage (RFCK, FBIN)................... –0.5V to VCC
XTAL Input Voltage (VXTAL1, 2) ......... VCC –1.9V to VCC
Output Current (IOUT)
LVPECL Outputs (Surge) .........................100mA
LVPECL Outputs (Continuous)...................50mA
LVDS Outputs...........................................±10mA
Lead Temperature (soldering, 20 sec.) .......... +260°C
Storage Temperature (Ts) ................. –65°C to 150°C
Operating Ratings
(2)
Supply Voltage
VCCOA and VCCOC ............................... +3.0V to +3.6V
VCCOB ............................................. +2.375V to +3.6V
Ambient Temperature (TA).......................–40°C to +85°C
Package Thermal Resistance (Junction-to-Ambient)
With Die attach soldered to GND:
TQFP (
θJA) Still-Air ......................................23°C/W
TQFP (
θJA) 200lfpm.....................................18°C/W
TQFP (
θJA) 500lfpm.....................................15°C/W
With Die attach NOT soldered to GND
(3):
TQFP (
θJA) Still-Air ......................................44°C/W
TQFP (
θJA) 200lfpm.....................................36°C/W
TQFP (
θJA) 500lfpm.....................................30°C/W
Package Thermal Resistance (Junction-to-Board)
TQFP (
θJC) ....................................................7°C/W
DC Electrical Characteristics
(4)
Power Supply
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCCA
PLL Power Supply
Note 5
3.0
3.3
3.6
V
VCCD
Control Logic Supply Voltage
Note 5
3.0
3.3
3.6
V
Output Supply Voltage
2.375
2.5
2.625
V
VCCO
3.0
3.3
3.6
V
ICC
Power Supply Current
No load, max. VCC, Note 6
240
300
mA
ICCA
Analog Supply Current
Max. VCC
10
mA
ICCO
Output Supply Current
No load, max. VCC
55
mA
ICCD
Digital Supply Current
Max. VCC
175
mA
LVCMOS/LVTTL Input Control Logic
VCCA = VCCD = +3.3V ±10%, VCCO = +2.5V ±5% or +3.3V ±10%; TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VIH
Input High Voltage
2.0
V
VIL
Input Low Voltage
0.8
V
IIH
Input High Current
VIN = VCC
–125
150
A
IIL
Input Low Current
VIN = 0.5V
–300
A
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. It is recommended that the user always solder the exposed die pad to a ground plane for enhanced heat dissipation.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VCCA and VCCD are not internally connected. They must be connected together on the PCB.
6. ICC = ICCA + ICCO + ICCD.
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