參數(shù)資料
| 型號： | SY58621LMG TR |
| 廠商： | Micrel Inc |
| 文件頁數(shù)： | 16/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | TXRX 3.2GBPS CML/LVPECL 24-MLF |
| 標準包裝： | 1,000 |
| 系列： | SY58 |
| 邏輯類型： | CML/LVPECL 背板收發(fā)器，帶集成環(huán)回 |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-VFQFN 裸露焊盤，24-MLF? |
| 供應商設備封裝： | 24-MLF?（4x4） |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | SY58621LMGTR SY58621LMGTR-ND |
Micrel, Inc.
SY89465U
August 2010
M9999-080510-C
hbwhelp@micrel.com or (408) 955-1690
5
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) ..........................–0.5V to +4.0V
Input Voltage (VIN) ..................................–0.5V to VCC
Input Current (IIN) ........................................................
Source/Sink Current on IN, /IN ................ ±50mA
Source/Sink Current on VT..................... ±100mA
VREF-AC Current
Source/Sink Current on VREF-AC.................. ±2mA
Lead Temperature (soldering, 20 sec.) ..........+260°C
Storage Temperature (Ts)..................–65°C to 150°C
Operating Ratings
(2)
Supply Voltage (VCC).................. +2.375V to +2.625V
Ambient Temperature (TA)................ –40°C to +85°C
Package Thermal Resistance
(3)
QFN (
θ JA)
Still-Air .................................................. 24.4°C/W
QFN (
ψ JB)
Junction-to-Board ................................... 8.1°C/W
DC Electrical Characteristics
(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
VCC
Power Supply
2.375
2.5
2.625
V
ICC
Power Supply Current
No load, max VCC
250
325
mA
RIN
Input Resistance (IN-to-VT)
45
50
55
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage (IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage (IN, /IN)
0
VIH – 0.1
V
VIN
Input Voltage Swing (IN, /IN)
See Figure 1a (Note 5)
0.1
2.5
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b
0.2
V
VIN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
VT_IN
IN-to-VT (IN, /IN)
1.28
V
VREF-AC
Output Reference Voltage
VCC – 1.3
VCC – 1.2
VCC – 1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θJA and
ψJB values are determined for a 4-layer board in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIN (max) is specified when VT is floating.
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相關代理商/技術參數(shù) |
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| SY58626L | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:DC-to-6.4Gbps Backplane Transmit Buffer with |
| SY58626L_10 | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:DC-to-6.4Gbps Backplane Transmit Buffer with |
| SY58626LMH | 功能描述:總線發(fā)射器 6.4Gbps Transmitter w/ Pre-emphasis (Green) RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:135 Mpps 接口: 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:TSSOP-56 封裝:Reel |
| SY58626LMH TR | 功能描述:總線發(fā)射器 6.4Gbps Transmitter w/ Pre-emphasis (Green) RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:135 Mpps 接口: 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:TSSOP-56 封裝:Reel |
| SY58626LMHTR | 制造商:MICREL 制造商全稱:Micrel Semiconductor 功能描述:DC-to-6.4Gbps Backplane Transmit Buffer with Selectable Output Pre-emphasis, I/O DCOffset Control, and 200mV-3.0VPP Output Swing |
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