參數(shù)資料
型號： STR711FR0T6
廠商： 意法半導體
英文描述： ARM7TDMI⑩ 16/32-BIT MCU WITH FLASH, USB, CAN 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES
中文描述： 16/32位微控制器ARM7TDMI的⑩5定時器，ADC和10 COMMUNICAT離子接口與閃存，USB，可以
文件頁數(shù)： 46/49頁
文件大小： 659K
代理商： STR711FR0T6
STR71xF - PACKAGE CHARACTERISTICS
46/49
3.2 Thermal Characteristics
The average chip-junction temperature, T
J
, in degrees Celsius, may be calculated using the
following equation:
T
J
= T
A
+ (P
D
x
Θ
JA
)
(1)
Where:
– T
A
is the Ambient Temperature in
°
C,
–
Θ
JA
is the Package Junction-to-Ambient Thermal Resistance, in
°
C/W,
– P
D
is the sum of P
INT
and P
I/O
(P
D
= P
INT
+ P
I/O
),
– P
INT
is the product of I
DD
and
V
DD
, expressed in Watts. This is the Chip Internal Power.
– P
I/O
represents the Power Dissipation on Input and Output Pins;
Most of the time for the applications P
I/O
<
P
INT
and may be neglected. On the other hand,
P
I/O
may be significant if the device is configured to drive continuously external modules and/
or memories.
An approximate relationship between P
D
and T
J
(if P
I/O
is neglected) is given by:
P
D
= K / (T
J
+ 273°C)
(2)
Therefore (solving equations 1 and 2):
K = P
D
x (T
A
+ 273°C) +
Θ
JA
x P
D2
(3)
where:
– K is a constant for the particular part, which may be determined from equation (3) by meas-
uring P
D
(at equilibrium) for a known T
A.
Using this value of K, the values of P
D
and T
J
may
be obtained by solving equations (1) and (2) iteratively for any value of T
A
.
Table 24. Thermal characteristics
Symbol
Parameter
Value
Unit
Θ
JA
Thermal Resistance Junction-Ambient
TQFP 144 - 20 x 20 mm / 0.5 mm pitch
42
°C/W
Θ
JA
Thermal Resistance Junction-Ambient
TQFP 64 - 10 x 10 mm / 0.5 mm pitch
45
°C/W
Θ
JA
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
TBD
°C/W
Θ
JA
Thermal Resistance Junction-Ambient
LFBGA 144 - 10 x 10 x 1.7mm
TBD
°C/W
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