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參數(shù)資料
| 型號： | ST7PLITE09Y0U6TR |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, MROM, 8 MHz, MICROCONTROLLER, QCC20 |
| 封裝： | QFN-20 |
| 文件頁數(shù)： | 16/123頁 |
| 文件大?。?/td> | 2176K |
| 代理商： | ST7PLITE09Y0U6TR |
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ST7LITE0x, ST7LITESx
112/123
14.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages will be converted
in 2005 to lead-free technology, named ECO-
PACKTM (for a detailed roadmap, please refer to
PCN CRP/04/744 "Lead-free Conversion Program
- Compliance with RoHS", issued November 18th,
2004).
■ ECOPACK
TM packages are qualified according
to the JEDEC STD-020C compliant soldering
profile.
■ Detailed information on the STMicroelectronics
ECOPACKTM transition program is available on
www.st.com/stonline/leadfree/,
with
specific
technical Application notes covering the main
technical
aspects
related
to
lead-free
conversion
(AN2033,
AN2034,
AN2035,
AN2036).
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACKTM TQFP, SDIP and SO packages
are fully compatible with Lead (Pb) containing
soldering process (see application note AN2034)
– TQFP, SDIP and SO Pb-packages are compati-
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Table 20. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
Package
Plating material devices
Pb solder paste
Pb-free solder paste
SDIP & PDIP
Sn (pure Tin)
Yes
Yes *
QFN
Sn (pure Tin)
Yes
Yes *
TQFP and SO
NiPdAu (Nickel-palladium-Gold)
Yes
Yes *
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