Data Sheet
FlashFlex51 MCU
SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD
SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD
63
2006 Silicon Storage Technology, Inc.
S71255-05-000
5/06
14.0 ELECTRICAL SPECIFICATION
Note: This specification contains preliminary information on new products in production.
Specifications are subject to change without notice.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Voltage on EA# Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
D.C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20ns) on Any Other Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD+1.0V
Maximum IOL per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Maximum IOL per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Solder Reflow Temperature1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
1. Excluding certain with-Pb 32-PLCC units, all packages are 260
°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240
°C for 10 seconds; please consult the factory for the latest information.
Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
TABLE
14-1: Operating Range
Symbol
Description
Min.
Max
Unit
TA
Ambient Temperature Under Bias
Standard
0
+70
°C
Industrial
-40
+85
°C
VDD
Supply Voltage
SST89E5xRD2/RD
4.5
5.5
V
SST89V5xRD2/RD
2.7
3.6
V
fOSC
Oscillator Frequency
SST89E5xRD2/RD
0
40
MHz
SST89V5xRD2/RD
0
33
MHz
Oscillator Frequency for IAP
SST89E5xRD2/RD
.25
40
MHz
SST89V5xRD2/RD
.25
33
MHz
T14-1.0 1255