參數(shù)資料
型號： SPC560B50L5C5E0Y
廠商： STMICROELECTRONICS
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-144
文件頁數(shù)： 13/74頁
文件大?。?/td> 971K
代理商： SPC560B50L5C5E0Y
SPC560Bx, SPC560Cx
Electrical characteristics
Doc ID 14619 Rev 4
4.6
Thermal characteristics
4.6.1
Package thermal characteristics
4.6.2
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using
Equation 1
TJ = TA + (PD x RθJA)
Where:
TA is the ambient temperature in °C.
RθJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PI/O (PD = PINT + PI/O).
PINT is the product of IDD and VDD, expressed in watts. This is the chip internal
power.
PI/O represents the power dissipation on input and output pins; user determined.
Most of the time for the applications, PI/O< PINT and may be neglected. On the other hand,
PI/O may be significant, if the device is configured to continuously drive external modules
and/or memories.
Table 10.
LQFP thermal characteristics(1)
Symbol
C
Parameter
Conditions(2)
Pin count
Value(3)
Unit
Min
Typ
Max
RθJA CC
D
Thermal resistance,
junction-to-ambient
natural convection(4)
Single-layer board—1s
100
—
64
°C/W
144
—
64
Four-layer board—2s2p
100
—
50.8
144
—
49.4
1.
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
2.
VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C.
3.
All values need to be confirmed during device validation.
4.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets
JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA and RthJMA.
Table 11.
LBGA208 thermal characteristics(1)
Symbol
C
Parameter
Conditions
Value
Unit
RθJA CC —
Thermal resistance, junction-to-ambient
natural convection(2)
Single-layer board—1s
TBD
°C/W
Four-layer board—2s2p
1.
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
2.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets
JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA and RthJMA.
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參數(shù)描述
SPC560B50L5C6E0X 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
SPC560B50L5C6E0Y 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 64 MHz 512kB Body RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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SPC560B60L3C6E0X 制造商:STMicroelectronics 功能描述:MID MICROCONTROLLER - Tape and Reel 制造商:STMicroelectronics 功能描述:IC MCU 32BIT 1MB FLASH 100LQFP
SPC560B60L5C6E0X 制造商:STMicroelectronics 功能描述:IC MCU 32BIT 1MB FLASH 144LQFP
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