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2
Rev: C Date:2/1/06
SP526 Multi–Mode Serial Transceiver
Copyright 2006 Sipex Corporation
-
T
A = +25°C and VCC = +4.75V to +5.25V unless otherwise noted.
PARAMETER
MIN.
TYP.
MAX.
UNITS
CONDITIONS
LOGIC INPUTS
V
IL
0.8
Volts
V
IH
2.0
Volts
LOGIC OUTPUTS
V
OL
0.4
Volts
I
OUT= – 3.2mA
V
OH
2.4
Volts
I
OUT= 1.0mA
V.28 DRIVER
DC Parameters
Outputs
Open Circuit Voltage
±15
Volts
per Figure 1
Loaded Voltage
±5.0
±15
Volts
per Figure 2
Short-Circuit Current
±100
mA
per Figure 4
Power-Off Impedance
300
per Figure 5
AC Parameters
V
CC = +5V for AC parameters
Outputs
Transition Time
1.5
s
per Figure 6; +3V to -3V
Instantaneous Slew Rate
30
V/s
per Figure 3
Propagation Delay
t
PHL
0.5
1
5
s
t
PLH
0.5
1
5
s
Max.Transmission Rate
120
230
kbps
V.28 RECEIVER
DC Parameters
Inputs
Input Impedance
3
7
k
per Figure 7
Open-Circuit Bias
+2.0
Volts
per Figure 8
HIGH Threshold
1.7
3.0
Volts
LOW Threshold
0.8
1.2
Volts
AC Parameters
V
CC = +5V for AC parameters
Propagation Delay
t
PHL
50
100
500
ns
t
PLH
50
100
500
ns
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability.
V
CC............................................................................+7V
Input Voltages:
Logic...............................-0.3V to (V
CC+0.5V)
Drivers............................-0.3V to (V
CC+0.5V)
Receivers........................................±15.5V
Output Voltages:
Logic................................-0.3V to (V
CC+0.5V)
Drivers................................................±15V
Receivers........................-0.3V to (V
CC+0.5V)
Storage Temperature..........................-65C to +150C
Power Dissipation
(derate 14.3mW/C above 70C)................1144mW
STORAGE CONSIDERATIONS
Due to the relatively large package size of the 44-pin
quad flat-pack, storage in a low humidity environment
is preferred. Large high density plastic packages are
moisture sensitive and should be stored in Dry Vapor
Barrier Bags. Prior to usage, the parts should remain
bagged and stored below 40°C and 60%RH. If the
parts are removed from the bag, they should be used
within 48 hours or stored in an environment at or below
20%RH. If the above conditions cannot be followed,
the parts should be baked for four hours at 125°C
in order remove moisture prior to soldering. Sipex ships
the 44-pin QFP in Dry Vapor Barrier Bags with
a humidity indicator card and desiccant pack. The
humidity indicator should be below 30%RH.
ELECTRICAL CHARACTERISTICS