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參數(shù)資料
| 型號： | SN54AS885JT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 算術(shù)邏輯單元 |
| 英文描述： | AS SERIES, 8-BIT MAGNITUDE COMPARATOR, TRUE OUTPUT, CDIP24 |
| 封裝： | 0.300 INCH, CERAMIC, DIP-24 |
| 文件頁數(shù)： | 18/18頁 |
| 文件大?。?/td> | 573K |
| 代理商： | SN54AS885JT |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-89757013A
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE
N / A for Pkg Type
5962-8975701KA
ACTIVE
CFP
W
24
1
TBD
A42
N / A for Pkg Type
5962-8975701LA
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SN54AS885JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SN74AS885DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS885DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS885DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS885DWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS885DWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS885DWRG4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AS885NT
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AS885NT3
OBSOLETE
PDIP
NT
24
TBD
Call TI
SN74AS885NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SNJ54AS885FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE
N / A for Pkg Type
SNJ54AS885JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54AS885W
ACTIVE
CFP
W
24
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Addendum-Page 1
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