
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
40
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74AHC595D
ACTIVE
16
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
40
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
90
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DBR
ACTIVE
SSOP
DB
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DBRE4
ACTIVE
SSOP
DB
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DR
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DRE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595N
ACTIVE
PDIP
N
16
CU NIPDAU
Level-NC-NC-NC
SN74AHC595NSR
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595NSRE4
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PW
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWE4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWR
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWRG4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
for the latest availability information and additional product content details. The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2005
Addendum-Page 1