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參數(shù)資料
| 型號： | SLE 5542 M3.2 |
| 廠商： | Infineon Technologies |
| 文件頁數(shù)： | 4/6頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MEMORY |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | * |
| 其它名稱： | SLE 5542 M3.2DKR |
SLE 5542
Short Product Information
4 / 6
2006-05-19
1
Ordering and Packaging information
Table 1
Ordering Information
Type
Package1)
Remark
Ordering Code
SLE 5542 C
Die (on Wafer)
unsawn
on request
SLE 5542 D
Die (on Wafer)
sawn
on request
SLE 5542 M3
T-M3.2-6
on request
SLE 5542 MFC3
S-MFC3.1-6-1
FCoS
on request
Pin Description
Figure 1
Pin Configuration Wire-bonded Module M3.2 (top view)
Figure 2
Pin Configuration Module Flip Chip MFC3.1 (top view)
1) Available as a Module Flip Chip (MFC3), wire-bonded module (M3) for embedding in plastic cards or as a die on
unsawn (C) / sawn wafer (D) for customer packaging
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| SLE5542M32XHSA2 | 制造商:Infineon Technologies AG 功能描述:MEMORIES 制造商:Infineon Technologies AG 功能描述:MEMORIES - Tape and Reel 制造商:Infineon Technologies AG 功能描述:IC MEMORY |
| SLE5542M32XHSA3 | 制造商:Infineon Technologies AG 功能描述:MEMORIES - Tape and Reel |
| SLE5542M32XHSA4 | 制造商:Infineon Technologies AG 功能描述:MEMORIES - Tape and Reel |
| SLE5542M32XHSA5 | 制造商:Infineon Technologies AG 功能描述:MEMORIES - Tape and Reel |
| SLE5542M32XHSA6 | 制造商:Infineon Technologies AG 功能描述:MEMORIES - Tape and Reel |
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