參數資料
型號: SG2524N
廠商: 意法半導體
英文描述: REGULATING PULSE WIDTH MODULATORS
中文描述: 調控脈寬調制器
文件頁數: 2/6頁
文件大小: 82K
代理商: SG2524N
SG1524/SG2524/SG3524
4/90 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
Garden Grove, CA 92841
(714) 898-8121
FAX: (714) 893-2570
2
Oscillator Charging Current ................................................5mA
Operating Junction Temperature
Hermetic (J, L Packages) ............................................. 150
°
C
Plastic (N, D Packages) ............................................... 150
°
C
Storage Temperature Range .............................-65
°
C to 150
°
C
Lead Temperature (Soldering, 10 seconds) .................... 300
°
C
Input Voltage (+V
)............................................................. 42V
Collector Voltage ................................................................ 40V
Logic Inputs...........................................................-0.3V to 5.5V
Current Limit Sense Inputs ...................................-0.3V to 0.3V
Output Current (each transistor) .................................... 100mA
Reference Load Current .................................................. 50mA
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Note 1. Values beyond which damage may occur.
Input Voltage (+V
) ...................................................
Collector Voltage .......................................................
Error Amp Common Mode Range ..........................
Current Limit Sense Common Mode Range ........
Output Current (each transistor) ...............................
Reference Load Current ...........................................
Oscillator Charging Current ..................................
8V to 40V
0V to 40V
1.8V to 3.4V
-0.3V to 0.3V
0 to 50mA
0 to 20mA
30
μ
A to 2mA
Oscillator Frequency Range .........................
Oscillator Timing Resistor (R
T
) ........................
Oscillator Timing Capacitor (C
) ............................
Operating Ambient Temperature Range
SG1524 .........................................................
SG2524 ...........................................................
SG3524 ...............................................................
100Hz to 300KHz
1.8K
to 100K
1nF to 1.0
μ
F
-55
°
C to 125
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
Note 2: Range over which the device is functional and parameter limits are guaranteed.
RECOMMENDED OPERATING CONDITIONS
(Note 2)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1524 with -55
°
C
T
125
°
C, SG2524 with
-25
°
C
T
85
°
C, SG3524 with 0
°
C
T
70
°
C, and +V
IN
= 20V. Low duty cycle pulse testing techniques are used which maintains junction and
case temperatures equal to the ambient temperature.)
Note 3. I
L
= 0mA
5.00
50
Reference Section
(Note 3)
Output Voltage
Line Regulation
Load Regulation
Temperature Stability
(Note 7)
Total Output Voltage Range
(Note 7)
Short Circuit Current
T
J
= 25
°
C
V
= 8V to 40V
I
= 0 to 20mA
Over Operating Temperature Range
Over Line, Load and Temperature
V
REF
= 0V
Min. Typ. Max. Min. Typ. Max.
SG3524
SG1524/2524
Units
Test Conditions
Parameter
4.80
4.80
25
5.20
20
50
50
5.20
150
4.60
4.60
25
5.00
50
5.40
30
50
50
5.40
150
V
mV
mV
mV
V
mA
THERMAL DATA
J Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 30°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 80°C/W
N Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 40°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............. 65°C/W
D Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................... 50°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
........... 120°C/W
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
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