參數(shù)資料
型號: SC16IS740IPW/Q900,
廠商: NXP Semiconductors
文件頁數(shù): 15/16頁
文件大小: 0K
描述: IC UART SINGLE W/FIFO 16-TSSOP
標(biāo)準(zhǔn)包裝: 1
特點(diǎn): 低電流
通道數(shù): 1,UART
FIFO's: 64 字節(jié)
規(guī)程: RS232,RS485
電源電壓: 2.5V, 3.3V
帶自動流量控制功能:
帶故障啟動位檢測功能:
帶調(diào)制解調(diào)器控制功能:
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: 568-6674-6
2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FIN224C Rev. 1.0.9
8
SerD
es
FIN
224C
24-
B
it
Low-
P
ower
Serializer/D
eserializer
Physical Dimensions
NOTES:
A. CONFORMS TO JEDEC REGISTRATION MO-220, VARIATION
WJJD-2 WITH EXCEPTION THAT THIS IS A SAWN VERSION..
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994.
D. LAND PATTERN PER IPC SM-782.
E. WIDTH REDUCED TO AVOID SOLDER BRIDGING.
F. DIMENSIONS ARE NOT INCLUSIVE OF BURRS, MOLD FLASH, OR
TIE BAR PROTRUSIONS.
G. DRAWING FILENAME: MKT-MLP40Arev3.
6.00
0.80 MAX
0.10 C
SEATING
PLANE
0.08 C 0.05
0.00
(0.20)
C
0.15 C
PIN #1 IDENT
0.50
4.20
4.00
0.50
0.30
4.20
4.00
0.50
0.10
CA B
0.05
C
0.18-0.30
A
B
6.38MIN
0.20MIN
4.77MIN
4.37MAX
0.28 MAX
0.50TYP
(0.80)
X4
X40
E
(DATUM A)
(DATUM B)
PIN #1 ID
Figure 6. 40-Lead, Molded Leadless Package (MLP), Quad, JEDEC MO-220, 6mm Square
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packaging/MLP40A.html
Ordering Information
Part Number
Operating
Temperature Range
Eco Status
Package
Packing Method
FIN224CMLX
-30 to +70°C
Green
40-Lead, Molded Leadless Package (MLP),
Quad, JEDEC MO-220, 6mm Square
Tape & Reel
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
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