- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄11828 > SC16C850IET,151 (NXP Semiconductors)IC UART SINGLE W/FIFO 36-TFBGA PDF資料下載
參數(shù)資料
| 型號： | SC16C850IET,151 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 46/55頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART SINGLE W/FIFO 36-TFBGA |
| 標(biāo)準包裝： | 490 |
| 特點： | 可編程 |
| 通道數(shù)： | 1，UART |
| FIFO's： | 128 字節(jié) |
| 規(guī)程： | RS485 |
| 電源電壓： | 2.5 V ~ 3.3 V |
| 帶自動流量控制功能： | 是 |
| 帶IrDA 編碼器/解碼器： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調(diào)制解調(diào)器控制功能： | 是 |
| 帶CMOS： | 是 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 36-TFBGA |
| 供應(yīng)商設(shè)備封裝： | 36-TFBGA（3.5x3.5） |
| 包裝： | 托盤 |
| 其它名稱： | 935284685151 SC16C850IET-S SC16C850IET-S-ND |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁當(dāng)前第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁
SC16C850
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 11 November 2010
50 of 55
NXP Semiconductors
SC16C850
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 25) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 39 and 40
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25.
Table 39.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 40.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SC16IS750IPW-T | IC UART I2C/SPI 24-TSSOP |
| ATMEGA16L-8MUR | MCU AVR 16KB FLASH 16MHZ 44QFN |
| VE-B5B-IY | CONVERTER MOD DC/DC 95V 50W |
| VE-B3Y-IY | CONVERTER MOD DC/DC 3.3V 33W |
| VE-B3W-IY | CONVERTER MOD DC/DC 5.5V 50W |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C850IET-G | 功能描述:UART 接口集成電路 16C 2.5-5V 5MBPS UART 128BFIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C850IET-S | 功能描述:UART 接口集成電路 16C 2.5-5V 5MBPS UART 128BFIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C850L | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V single UART, 5 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface |
| SC16C850LIB,128 | 制造商:NXP Semiconductors 功能描述: |
| SC16C850LIB,151 | 制造商:NXP Semiconductors 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。