參數(shù)資料
型號: SAF-XE162FM-48F80L
廠商: INFINEON TECHNOLOGIES AG
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP64
封裝: 0.50 MM PITCH, GREEN, PLASTIC, LQFP-64
文件頁數(shù): 6/107頁
文件大?。?/td> 1608K
代理商: SAF-XE162FM-48F80L
XE162FM, XE162HM
XE166 Family / Base Line
Package and Reliability
Data Sheet
103
V2.1, 2011-07
5
Package and Reliability
The XE166 Family devices use the package type PG-LQFP (Plastic Green - Low Profile
Quad Flat Package). The following specifications must be regarded to ensure proper
integration of the XE162xM in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Package Compatibility Considerations
The XE162xM is a member of the XE166 Family of microcontrollers. It is also compatible
to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Table 35
Package Parameters (PG-LQFP-64-13)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Power Dissipation
P
DISS
–1.0
W
Thermal resistance
Junction-Ambient
RΘJA
58
K/W No thermal via
1)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
46
K/W 4-layer, no pad
2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias.
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