參數(shù)資料
型號： SAA7356HL
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： 1394 SBP-2 link layer controller
中文描述： 1 CHANNEL(S), SERIAL COMM CONTROLLER, PQFP80
封裝： PLASTIC, QFP-80
文件頁數(shù)： 33/36頁
文件大?。?/td> 157K
代理商： SAA7356HL
2000 Nov 17
33
Philips Semiconductors
Preliminary specification
1394 SBP-2 link layer controller
SAA7356HL
15.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
SAA7360GPB Analog-to-Digital Converter， 18-Bit
SAA7366TD-T Analog-to-Digital Converter， 18-Bit
SAA7360 Bitstream conversion ADC for digital audio systems
SAA7360GP Bitstream conversion ADC for digital audio systems
SAA7366 Bitstream conversion ADC for digital audio systems
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA7360 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bitstream conversion ADC for digital audio systems
SAA7360GP 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bitstream conversion ADC for digital audio systems
SAA7360GPB 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog-to-Digital Converter， 18-Bit
SAA7366 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bitstream conversion ADC for digital audio systems
SAA7366T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Bitstream conversion ADC for digital audio systems
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