參數(shù)資料
型號(hào)： SA58635UK
廠商： NXP SEMICONDUCTORS
元件分類： 音頻／視頻放大
英文描述： 2 x 25 mW class-G stereo headphone driver with I2C-bus volume control
中文描述： AUDIO AMPLIFIER, PBGA16
封裝： 1.70 X 1.70 MM, 0.56 MM HEIGHT, WLCSP-16
文件頁(yè)數(shù)： 16/30頁(yè)
文件大?。?/td> 277K
代理商： SA58635UK
SA58635_1
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 26 March 2010
23 of 30
NXP Semiconductors
SA58635
2
× 25 mW class-G stereo headphone driver
For a required 3 dB cut-off frequency, Equation 2 is used to determine Ci:
(2)
For Ci =1 μF, the 3 dB cut-off frequency will vary with gain settings. For gain setting of
4 dB, the SA58635 input resistance, Ri is 11.06 kΩ (refer to Table 14). Substituting Ri and
Ci in Equation 1 yields f3dB =14.4Hz.
13.3 PCB layout considerations
Component location is very important for performance of the SA58635. Place all external
components very close to the device. Placing decoupling capacitors directly at the power
supply pins increases efficiency because the resistance and inductance in the trace
between the device power supply pins and the decoupling capacitor causes a loss in
power efficiency.
The trace width and routing are also very important for power output and noise
considerations.
For the input pins (INLP, INLN, INRP, INRN), the traces must be symmetrical and run
side-by-side to maximize common-mode cancellation.
13.4 Thermal information
The SA58635 16-bump WLCSP package ground bumps are soldered directly to the PCB
heat spreader. The heat spreader is the PCB ground plane or special heat sinking layer
designed into the PCB. The thickness and area of the heat spreader may be maximized to
optimize heat transfer and achieve lower package thermal resistance.
C
i
1
2
π R
i
×
f
3dB
–
×
------------------------------------
=
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SA58635UK,027 功能描述:音頻放大器 2x25mW cls-G stereo headphone driver RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SA58637 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 2.2 W BTL audio amplifier
SA58637BS 制造商:NXP Semiconductors 功能描述:AMP AUDIO 2.2W STER D 20HVQFN 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 2.2W, STER, D, 20HVQFN
SA58637BS,118 功能描述:音頻放大器 DUAL 2.2W/CH. BTL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SA58637BS118 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20
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