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參數(shù)資料
| 型號： | SA58632 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 2 x 2.2 W BTL audio amplifier |
| 中文描述： | 2 × 2.2糯橋接音頻放大器 |
| 文件頁數(shù)： | 24/26頁 |
| 文件大?。?/td> | 174K |
| 代理商： | SA58632 |
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SA58632_1
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 27 June 2006
24 of 26
Philips Semiconductors
SA58632
2
×
2.2 W BTL audio amplifier
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
17. Abbreviations
18. Revision history
Table 11.
Acronym
BTL
CMOS
DAP
ESD
NPN
PCB
PNP
RMS
SE
THD
Abbreviations
Description
Bridge-Tied Load
Complementary Metal Oxide Semiconductor
Die Attach Paddle
ElectroStatic Discharge
Negative-Positive-Negative
Printed-Circuit Board
Positive-Negative-Positive
Root Mean Squared
Single-Ended
Total Harmonic Distortion
Table 12.
Document ID
SA58632_1
Revision history
Release date
20060627
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58632BS | 制造商:NXP Semiconductors 功能描述:IC AMP AUDIO 2.2W STER 20HVQFN 制造商:NXP Semiconductors 功能描述:IC, AMP, AUDIO, 2.2W, STER, 20HVQFN |
| SA58632BS,118 | 功能描述:音頻放大器 2X2.2W BTL PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58632BS118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20 |
| SA58632BS-T | 功能描述:音頻放大器 2X2.2W BTL PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58635UK,027 | 功能描述:音頻放大器 2x25mW cls-G stereo headphone driver RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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