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參數(shù)資料
| 型號： | S71GL064N40BFW0Z0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM |
| 文件頁數(shù)： | 8/11頁 |
| 文件大?。?/td> | 340K |
| 代理商： | S71GL064N40BFW0Z0 |
8
S71GL-N Based MCPs
S71GL-N_00_02 June 19, 2007
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
5.
Ordering Information
The order number is formed by a valid combinations of the following:
Note
1. Type 0 is standard. Specify other options as required.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S71GL
064
N
A0
BF
W
0
Z
0
PACKING TYPE
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
See the
Valid Combinations
table.
PACKAGE MODIFIER
0
= 7 x 9 mm, 1.2 mm height, 56 balls (TLC056)
TEMPERATURE RANGE
W = Wireless (-25
°
C to +85
°
C)
PACKAGE TYPE
BF = Fine-pitch BGA Lead (Pb)-free package
pSRAM / SRAM DENSITY
B0 = 32 Mb pSRAM
A0 = 16 Mb pSRAM
40 = 4 Mb pSRAM
80 = 8 Mb pSRAM
PROCESS TECHNOLOGY
N
= 110 nm, MirrorBit Technology
FLASH DENSITY
064
= 64Mb
032
= 32Mb
PRODUCT FAMILY
S71GL Multi-chip Product (MCP)
3.0-volt Page Mode Flash Memory and RAM
Table 5.1
Valid Combinations
S71GL064N Valid Combinations
Speed Options (ns)/Boot
Sector Option
(p)SRAM Type/
Access Time
(ns)
Package
Marking
Base Ordering
Part Number
Package &
Temperature
Package Modifier/Model
Number
Packing Type
S71GL032N40
BFW
0K
0, 2, 3
(1)
90 / Bottom Boot Sector
pSRAM9 / 70
TLC056
0P
90 / Top Boot Sector
S71GL032N80
0K
90 / Bottom Boot Sector
pSRAM9 / 70
0P
90 / Top Boot Sector
S71GL032NA0
0U
90 / Bottom Boot Sector
pSRAM7 / 70
0Z
90 / Top Boot Sector
S71GL064NA0
0U
90 / Bottom Boot Sector
pSRAM7 / 70
S71GL064NA0
0Z
90 / Top Boot Sector
S71GL064NB0
0U
90 / Bottom Boot Sector
pSRAM8 / 70
S71GL064NB0
0Z
90 / Top Boot Sector
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| S71GL064N40BFW0Z2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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| S71GL064N80BFW0Z0 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71GL064N40BFW0Z2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064N40BFW0Z3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064N80BFW0Z0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064N80BFW0Z2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064N80BFW0Z3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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