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參數(shù)資料
| 型號： | S71GL064N40BFW0Z0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM |
| 文件頁數(shù)： | 6/11頁 |
| 文件大?。?/td> | 340K |
| 代理商： | S71GL064N40BFW0Z0 |
6
S71GL-N Based MCPs
S71GL-N_00_02 June 19, 2007
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
3.
Connection Diagram
Note
May be shared depending on density.
3.1
Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150
°
C for prolonged periods of time.
MCP
Flash-only Addresses
Shared Addresses
S71GL032NA0
A20
A19-A0
S71GL032N80
A20-A19
A18-A0
S71GL032N40
A20-A18
A17-A0
S71GL064NB0
A21
A20-A0
S71GL064NA0
A21-A20
A19-A0
C3
UB#
D3
A18
E3
A17
F3
DQ1
G3
DQ9
H3
DQ10
DQ2
B3
LB#
C5
CE2s
A20
G5
DQ4
H5
VCCs
RFU
B5
WE#
C6
A19
D6
A9
E6
A10
F6
DQ6
G6
DQ13
H6
DQ12
DQ5
B6
A8
C4
RST#f
RY/BY#
G4
DQ3
H4
VCCf
DQ11
B4
WP/ACC
C7
A12
D7
A13
E7
A14
F7
RFU
G7
DQ15
H7
DQ7
DQ14
B7
A11
C8
A15
D8
A21
E8
RFU
F8
A16
G8
RFU
VSS
C2
A6
D2
A5
E2
A4
F2
VSS
G2
OE#
H2
DQ0
CE1#s
DQ8
B2
A7
C1
A3
D1
A2
E1
A1
F1
A0
G1
CE1#f
F5
F4
B1
B8
A3
A5
A6
A4
A7
A2
RAM only
Shared
(Note 1)
Flash only
Legend
Reserved for
Future Use
56-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)
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