參數(shù)資料
型號: S29GL032M10BFIR50
廠商: SPANSION LLC
元件分類: DRAM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封裝: 8 X 6 MM, LEAD FREE, BGA-48
文件頁數(shù): 145/159頁
文件大?。?/td> 2217K
代理商: S29GL032M10BFIR50
Octorber 18, 2004 S29GLxxxM_00_B3
S29GLxxxM MirrorBit
TM
Flash Family
145
D a t a s h e e t
TS048—48-Pin Standard/Reverse Thin Small Outline Package (TSOP)
-X-
X = A OR B
e/2
DETAIL B
c
L
0.25MM (0.0098") BSC
0
DETAIL A
R
GAGE LINE
PARALLEL TO
SEATING PLANE
b
b1
(c)
7
6
c1
WITH PLATING
BASE METAL
7
C A-B S
M
0.08MM (0.0031")
SECTION B-B
e
0.10 C
A2
PLANE
SEATING
C
A1
SEE DETAIL B
B
B
B
B
SEE DETAIL A
2
STANDARD PIN OUT (TOP VIEW)
2
N
N
1
4
2
A
-A-
-B-
5
9
E
5
D1
D
6
2
3
4
5
7
8
9
TS 048
MO-142 (B) EC
48
MIN
0.05
0.95
0.17
0.17
0.10
0.10
19.80
18.30
11.90
0.50
0
0.08
0.50 BASIC
0.60
3
MAX
1.20
0.15
1.05
0.27
0.16
0.21
20.20
5
0.20
18.50
12.10
0.70
0.23
0.20
0.22
1.00
18.40
12.00
20.00
NOM
Symbol
A
Jedec
Package
b1
b
c1
c
A2
A1
D
D1
L
0
R
N
e
E
1
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
NOT APPLICABLE.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15MM (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3325 \ 16-038.10a
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