參數(shù)資料
型號(hào): S29GL032M10BAIR42
廠商: SPANSION LLC
元件分類: PROM
英文描述: Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 33uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 3528-21; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 3.5mm x 2.8mm x 1.9mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 2,000; Features: Low Temperature
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封裝: 8 X 9 MM, FBGA-48
文件頁(yè)數(shù): 32/116頁(yè)
文件大?。?/td> 6024K
代理商: S29GL032M10BAIR42
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20
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B8 February 7, 2007
Data
Sheet
Ordering Information: S29GL128M
Standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the following:
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
7. Contact your Spansion representative for availability of the 90ns speed option for LAA064.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
This product has been retired and is not recommended for designs. For new and current designs, S29GL128P supersedes S29GL128M, and is the
factory-recommended migration path. Please refer to the S29GL-P Datasheet for specifications and ordering information.
S29GL128M
90
T
A
I
R1
0
PACKING TYPE
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
Model Number
R1
= x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address
sector protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
R8
= x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address
sector protected when WP#/ACC=VIL, FPT-56P-M01 package only
R9
= x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL, FPT-56P-M01 package only
TEMPERATURE RANGE
I
= Industrial (–40
°C to +85°C)
PACKAGE MATERIAL SET
A= Standard
F= Pb-Free
D= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL128M
128 Megabit Page-Mode Flash Memory Manufactured using 0.23 m MirrorBit
Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 3. S29GL128M Ordering Options
S29GL128M Valid Combinations
Package Descriptions
(Notes)
Base Ordering
Part Number
Speed
Option
Package Type, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL128M
90, 10, 11
TAI, TFI
R1, R2
0, 2, 3 (Note 1)
TS056 (2, 3, 5)
TSOP
TAI, TDI
R9
FPT-56P-M01 (3, 6)
FAI, FFI
R1, R2
LAA064 (4)
Fortified-BGA
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