參數(shù)資料
型號(hào): S29GL032A10TAIR11
廠商: Spansion Inc.
英文描述: Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked
中文描述: 64兆位32MEGABIT 3.0螺栓只頁(yè)面模式閃存
文件頁(yè)數(shù): 84/88頁(yè)
文件大小: 1425K
代理商: S29GL032A10TAIR11
January 28, 2005 S29GLxxxA_00_A2
S29GLxxxA MirrorBit Flash Family
83
Advance
Information
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
6
2
3
4
5
7
8
9
TS 056
MO-142 (D) EC
56
MIN
0.05
0.95
0.17
0.10
18.30
19.80
0.50
0
0.08
13.90
0.50 BASIC
MAX
0.15
1.20
0.27
0.16
0.21
8
0.20
18.50
14.10
0.70
20.20
0.23
1.05
0.20
1.00
0.22
18.40
20.00
0.60
14.00
NOM
Symbol
Jedec
Package
b1
A2
A1
A
D
L
e
E
D1
b
c1
c
0
R
N
1
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15mm (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10mm (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
N
+1
2
N
1
2
N
3
REVERSE PIN OUT (TOP VIEW)
C
e
A1
A2
2X (N/2 TIPS)
0.10
9
SEATING
PLANE
A
SEE DETAIL A
B
AB
E
D1
D
2X
2X (N/2 TIPS)
0.25
2X
0.10
N
5
+1
N
2
4
5
1
N
2
STANDARD PIN OUT (TOP VIEW)
SEE DETAIL B
DETAIL A
(c)
θ°
L
0.25MM (0.0098") BSC
C
R
GAUGE PLANE
PARALLEL TO
SEATING PLANE
b
b1
(c)
7
6
c1
WITH PLATING
BASE METAL
7
0.08MM
(0.0031")
M
C A - B S
SECTION B-B
DETAIL B
X
e/2
X = A OR B
3356 \ 16-038.10c
相關(guān)PDF資料
PDF描述
S29GL032A10TAIR21 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A11BFIR31 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A11BFIR41 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR21 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR31 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29GL032A10TAIR12 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A10TAIR13 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A10TAIR20 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A10TAIR21 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A10TAIR22 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY