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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Input Voltage
26V to +0.3V
ESD Susceptibility (Note 2)
2 kV
Power Dissipation (Note 3)
Internally limited
Junction Temperature (T
Jmax)
125C
Storage Temperature Range
65C to +150C
Lead Temperature (Soldering, 10 sec.)
230C
Operating Ratings (Note 1)
Junction Temperature Range (T
J)
40C to +125C
Maximum Input Voltage (Operational)
26V
Electrical Characteristics
V
IN = 10V, VO = 3V, IO = 1A, CO = 47 F, R1 = 2.7k, TJ = 25C, unless otherwise specified. Boldface limits apply over
the entire operating junction temperature range.
Parameter
Conditions
Typical
Min
Max
Units
(Note 4)
Reference Voltage
5 mA
≤ I
O ≤ 1A
1.210
1.234
1.186
V
5mA
≤ I
O ≤ 1A,
1.27
1.15
V
O 1V ≥ VIN ≥ 26V
Output Voltage
2
3
V
Range
V
IN = 26V
25
24
V
Line Regulation
I
O = 5 mA, VO 1V ≥ VIN ≥ 26V
0.004
0.04
%/V
Load Regulation
50 mA
≤ I
O ≤ 1A
0.04
0.4
%
Dropout Voltage
I
O = 0.1A, VO ≤ 100 mV
0.1
0.2
V
0.3
I
O = 1A, VO ≤ 100 mV
0.6
0.8
V
1
Quiescent Current
I
O ≤ 1A
0.7
5
mA
Dropout Quiescent
V
IN =VO,IO ≤ 1A
16
50
mA
Current
Ripple Rejection
V
ripple = 1 Vrms, f ripple = 1 kHz,
60
50
dB
I
O =5 mA
Output Noise
10 Hz 100 kHz, I
O = 5 mA
200
450
V
ON /OFF Input
(V
OUT: ON)
1.2
0.8
V
Voltage
(V
OUT: OFF)
1.3
2.4
ON /OFF Input
V
ON/OFF = 0.8V (VOUT: ON)
0.1
10
A
Current
V
ON/OFF = 2.4V (VOUT: OFF)
40
100
Output Leakage
V
IN = 26V, VON/OFF = 2.4V
60
250
A
Current
V
OUT =0V
Current Limit
V
OUT = 0V
2
1.5
A
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the deivce is in-
tended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: Human body model, 100 pF discharged through a 1.5 k
resistor.
Note 3: The maximum power dissipation is a function of TJmax, θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD =(TJmax
TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 125C and the LM2991 will go into thermal shutdown. For the LM2991, the
junction-to-ambient thermal resistance is 53C/W for the TO-220, 73C/W for the TO-263, and junction-to-case thermal resistance is 3C. If the TO-263 package is
used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. Using 0.5 square inches of copper area,
θJA is 50C/W; with 1 square inch of copper area, θJA is 37C/W; and with 1.6 or more square inches of copper area, θJA is 32C/W.
Note 4: Typicals are at TJ = 25C and represent the most likely parametric norm.
LM2991
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