參數(shù)資料
型號: RF3133PCBA
廠商: RF Monolithics, Inc.
英文描述: QUAD-BAND GSM850/GSM/DCS/PCS POWER AMP MODULE
中文描述: 四頻GSM850/GSM/DCS/PCS功率放大器模塊
文件頁數(shù): 14/16頁
文件大?。?/td> 196K
代理商: RF3133PCBA
2-472
RF3133
Rev A4 030527
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is
3
μ
inch to 8
μ
inch Gold over 180
μ
inch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land and Solder Mask Pattern
Metal Land Pattern
0.00
0
1
5
2
5
0.80 (mm)
3.70 (mm)
1.50 (mm)
0.70 (mm)
3.00 (mm)
4.50 (mm) Typ.
6.00 (mm)
7.50 (mm)
9.00 (mm) Typ.
8.30 (mm)
5.30 (mm)
8.20 (mm)
0
A = 0.80 (mm) Sq. Typ.
B = 1.00 x 0.80 (mm) Typ.
Pin 1
A
B
A
A
A
A
A
A
A
A
B
B
Solder Mask Pattern
0
0.00
1
3
4
5
2
1.50 (mm) Typ.
3.00 (mm) Typ.
4.50 (mm) Typ.
6.00 (mm) Typ.
7.50 (mm) Typ.
9.00 (mm) Typ.
4.50 (mm)
Pin 1
0.05 (mm) Typ.
9.05 (mm) Typ.
B
C
D
E
E
E
E
D
D
A
B
B
B
C
C
C
C
A
A
A
A
A
A
A
A
F
A = 1.00 (mm) Sq. Typ.
B = 0.90 x 0.80 (mm) Typ.
C = 0.80 (mm) Sq. Typ.
D = 1.00 x 1.20 (mm) Typ.
E = 0.80 x 1.10 (mm) Typ.
F = 7.00 x 2.50 (mm) Typ.
Figure 1. PCB Metal Land and Solder Mask Pattern (Top View)
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