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參數(shù)資料
| 型號： | RF1K49223 |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | JFETs |
| 英文描述： | 2.5A, 30V, 0.150 Ohm, Dual P-Channel LittleFET⑩ Power MOSFET |
| 中文描述： | 2.5 A, 30 V, 0.36 ohm, 2 CHANNEL, P-CHANNEL, Si, POWER, MOSFET, MS-012AA |
| 文件頁數(shù)： | 2/8頁 |
| 文件大?。?/td> | 97K |
| 代理商： | RF1K49223 |
8-162
Absolute Maximum Ratings
T
A
= 25
o
C Unless Otherwise Specified
RF1K49223
-30
-30
±
20
UNITS
V
V
V
Drain to Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DSS
Drain to Gate Voltage (R
GS
= 20k
)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
GS
Drain Current
Continuous (Pulse Width = 5s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
D
Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
pkg
2.5
Refer to Peak Current Curve
Refer to UIS Curve
2
0.016
-55 to 150
A
W
W/
o
C
o
C
300
260
o
C
o
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. T
J
= 25
o
C to 125
o
C.
Electrical Specifications
T
A
= 25
o
C, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage
BV
DSS
I
D
= 250
μ
A, V
GS
= 0V, (Figure 12)
V
GS
= V
DS
, I
D
= 250
μ
A, (Figure 11)
-30
-
-
V
Gate to Source Threshold Voltage
V
GS(TH)
-1
-
-3
V
Zero Gate Voltage Drain Current
I
DSS
V
DS
= -30V,
V
GS
= 0V
T
A
= 25
o
C
T
A
= 150
o
C
-
-
-1
μ
A
-
-
-50
μ
A
Gate to Source Leakage Current
I
GSS
V
GS
=
±
20V
-
-
±
100
nA
Drain to Source On Resistance
r
DS(ON)
I
D
= 2.5A,
(Figure 9, 10)
V
GS
= -10V
-
-
0.150
V
GS
= -4.5V
-
-
0.360
Turn-On Time
t
ON
V
DD
= -15V, I
D
2.5A,
R
L
= 6
, V
GS
= -10V,
R
GS
= 25
-
-
40
ns
Turn-On Delay Time
t
d(ON)
-
9
-
ns
Rise Time
t
r
-
19
-
ns
Turn-Off Delay Time
t
d(OFF)
-
60
-
ns
Fall Time
t
f
-
34
-
ns
Turn-Off Time
t
OFF
-
-
140
ns
Total Gate Charge
Q
g(TOT)
V
GS
= 0V to -20V
V
DD
= -24V,
I
D
2.5A,
R
L
= 9.6
I
g(REF)
= -1.0mA
(Figure 14)
-
28
35
nC
Gate Charge at -10V
Q
g(-10)
V
GS
= 0V to -10V
-
15
19
nC
Threshold Gate Charge
Q
g(TH)
V
GS
= 0V to -2V
-
1.5
1.9
nC
Input Capacitance
C
ISS
V
DS
= -25V, V
GS
= 0V,
f = 1MHz
(Figure 13)
-
580
-
pF
Output Capacitance
C
OSS
-
260
-
pF
Reverse Transfer Capacitance
C
RSS
-
38
-
pF
Thermal Resistance Junction to Ambient
R
θ
JA
Pulse Width = 1s
Device mounted on FR-4 material
-
-
62.5
o
C/W
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Source to Drain Diode Voltage
V
SD
I
SD
= -2.5A
-
-
-1.25
V
Reverse Recovery Time
t
rr
I
SD
=-2.5A, dI
SD
/dt = 100A/
μ
s
-
-
49
ns
RF1K49223
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