參數(shù)資料
型號(hào): RC28F160C3BD70
廠商: INTEL CORP
元件分類: PROM
英文描述: 1M X 16 FLASH 3V PROM, 70 ns, PBGA64
封裝: BGA-64
文件頁(yè)數(shù): 19/72頁(yè)
文件大?。?/td> 1083K
代理商: RC28F160C3BD70
Intel Advanced+ Boot Block Flash Memory (C3)
May 2005
Intel Advanced+ Boot Block Flash Memory (C3)
Datasheet
26
Order Number: 290645, Revision: 023
Table 9.
Read Operations—16-Mbit Density
#Sym
Parameter
Density
16 Mbit
Notes
Product
70 ns
80 ns
90 ns
110 ns
VCC
2.7 V–3.6 V
3.0 V–3.6 V
2.7 V–3.6 V
3.0 V–3.6V
2.7 V–3.6V
Min
(ns)
Max
(ns)
Min
(ns)
Max
(ns)
Min
(ns)
Max
(ns)
Min
(ns)
Max
(ns)
Min
(ns)
Max
(ns)
Min
(ns)
Max
(ns)
R1
tAVAV
Read Cycle Time
70
80
90
100
110
3,4
R2
tAVQV
Address to Output
Delay
70
80
90
100
110
3,4
R3
tELQV
CE# to Output Delay
70
80
90
100
110
1,3,4
R4
tGLQV
OE# to Output Delay
20
30
1,3,4
R5
tPHQV
RP# to Output Delay
150
3,4
R6
tELQX
CE# to Output in Low Z
00
0
2,3,4
R7
tGLQX
OE# to Output in Low Z
00
0
2,3,4
R8
tEHQZ
CE# to Output in High
Z
20
2,3,4
R9
tGHQZ
OE# to Output in High
Z
20
2,3,4
R10
tOH
Output Hold from
Address, CE#, or OE#
Change, Whichever
Occurs First
00
0
2,3,4
Notes:
1.OE# may be delayed up to tELQV–tGLQV after the falling edge of CE# without impact on tELQV.
2.Sampled, but not 100% tested.
4.
See Figure 11, “AC Input/Output Reference Waveform” on page 33 for timing measurements and maximum allowable
input slew rate.
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