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參數(shù)資料
| 型號： | PMN5118USR |
| 廠商： | ERICSSON POWER MODULES AB |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 108 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT, SMD-14 |
| 文件頁數(shù)： | 12/37頁 |
| 文件大?。?/td> | 1906K |
| 代理商： | PMN5118USR |
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Ericsson Internal
PRODUCT SPECIFICATION
2 (4)
Prepared (also subject responsible if other)
No.
EWEIXIE
1/1301-BMR656 5118 Uen
Approved
Checked
Date
Rev
Reference
SEC/D (Julia You)
EMINTAO
2007-07-30
B
General Information
Ordering Information
See Contents for individual product ordering numbers.
Option
Suffix
Ordering No.
SMD pin
SMD pin with lead-free surface
S
SR
PMN 5118U S
PMN 5118U SR
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (T
A) of
+40°C, which is a typical condition in Information and
Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Predicted MTBF for the series is:
-
3.6 million hours according to Telcordia SR332, issue
1, Black box technique.
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
-
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
-
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
-
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
The exemption for lead in solder for servers, storage and
storage array systems, network infrastructure equipment
for switching, signaling, transmission as well as network
management for telecommunication is only utilized in
surface mount products intended for end-users’ leaded
SnPb Eutectic soldering processes. (See ordering
information table)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
E
PMN 5000 series
POL regulator, Input 4.5-5.5 V, Output up to 30 A/108 W
EN/LZT 146 386 R1A
July 2007
Ericsson Power Modules AB
Technical Specification
2
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