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參數(shù)資料
| 型號： | PIP202-12M |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | DC to DC converter powertrain |
| 中文描述： | SPECIALTY ANALOG CIRCUIT, PQCC68 |
| 封裝： | 10 X 10 X 0.85 MM, PLASTIC, HVQFN-68 |
| 文件頁數(shù)： | 15/20頁 |
| 文件大小： | 156K |
| 代理商： | PIP202-12M |
Philips Semiconductors
PIP202-12M
DC to DC converter powertrain
Product data
Rev. 01 — 15 July 2002
15 of 20
9397 750 10031
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
15. Soldering
15.1 Introduction to soldering MLF packages
The MicroLeadFrame package (MLF) is a near Chip Scale Package (CSP) with a
copper leadframe. It is a leadless package, where electrical contact to the printed
circuit board is made through metal pads on the underside of the package. In addition
to the small pads around the periphery of the package, there are large pads on the
underside that provide low thermal resistance, low electrical resistance, low
inductance connections between the power components inside the MLF package and
the PCB. It is this feature of the MLF package that makes it ideally suited for VRM
applications.
Electrical connection between the package and the printed circuit board is made by
printing solder paste on the printed circuit board, placing the component and
reflowing the solder in a convection or infra-red oven. The solder reflow process is
shown in
Figure 18
and the typical temperature profile is shown in
Figure 19
. To
ensure good solder joints, the peak temperature T
p
should not exceed 220
°
C for thin
packages such as MLF, and the time above liquidus temperature should be less than
1.25 minutes. The maximum temperature can be increased for lead free solder. The
ramp rate during preheat should not exceed 3 K/s. Nitrogen purge is recommended
during reflow.
Fig 18. Typical reflow soldering process flow.
Fig 19. Typical reflow soldering temperature profile.
SOLDER PASTE
PRINTING
POST PRINT
INSPECTION
COMPONENT
PLACEMENT
PRE REFLOW
INSPECTION
REFLOW SOLDERING
POST REFLOW INSPECTION
(PREFERABLY X-RAY)
REWORK AND
TOUCH UP
03aj25
03aj26
0
100
200
300
0
1
2
3
time (minutes)
Temp
(
°
C)
Tr
Te
Tp
rate of rise of
temperature < 3 K/s
1 min max
1.25 min max
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIP202-12M-2 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC-to-DC converter powertrain |
| PIP202-12M-2 /T3 | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| PIP202-12M-2,518 | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 TAPE7 MOSFET RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| PIP20-5,08 | 功能描述:可插拔接線端子 PCB Hdr, 45 Deg, 5,08 PitchClosed End,20pole,12A,300V,Grn RoHS:否 制造商:Phoenix Contact 產(chǎn)品:Plugs 系列:PTS 端接類型:Spring Cage 位置/觸點數(shù)量:5 線規(guī)量程:26-14 節(jié)距:5 mm 電流額定值:10 A 電壓額定值:250 V 安裝風(fēng)格: 安裝角: 觸點電鍍: |
| PIP206 | 制造商:SENSITRON 制造商全稱:Sensitron 功能描述:Transient Voltage Suppressor, Unidirectional |
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