參數(shù)資料
型號(hào)： PIP202-12M
廠商： NXP SEMICONDUCTORS
元件分類： 模擬信號(hào)調(diào)理
英文描述： DC to DC converter powertrain
中文描述： SPECIALTY ANALOG CIRCUIT, PQCC68
封裝： 10 X 10 X 0.85 MM, PLASTIC, HVQFN-68
文件頁(yè)數(shù)： 12/20頁(yè)
文件大小： 156K
代理商： PIP202-12M
Philips Semiconductors
PIP202-12M
DC to DC converter powertrain
Product data
Rev. 01 — 15 July 2002
12 of 20
9397 750 10031
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
thermal resistance of this package, the printed-circuit board must be designed so that
heat is conducted away efficiently from the package. This can be achieved by
maximizing the area of copper around each pad, and by incorporating thermal vias to
conduct the heat to inner and/or bottom layers of the printed-circuit board.
An example of a thermal via pattern is shown in
Figure 13
. In a typical application,
with no forced air cooling, the use of thermal vias typically reduces the thermal
resistance from 25 K/W to 20 K/W. The additional use of a small fan can reduce this
further to approximately 15 K/W.
The thermal resistance of a particular design can be measured by passing a known
current between V
SSO
and V
DDO
. The current flows through the Schottky diode and
through the source-drain diode of the upper MOSFET. The direction of current flow is
into V
SSO
and out of V
DDO
. The volt drop between V
SSO
and V
DDO
is then measured
and used to calculate the power dissipation in the PIP202-12M. The case
temperature of the PIP202-12M can be measured using an infra-red thermometer.
The thermal resistance can then be calculated using the following equation:
(3)
where T
case
is the measured case temperature (
°
C), T
amb
is the ambient
temperature (
°
C), I is the MOSFET current (A), and V
F
is the voltage drop between
V
SSO
and V
DDO
(V).
Where more than one phase is used, for example the circuit of
Figure 11
, the thermal
resistance of each PIP202-12M should be measured with current flowing in all
phases.
All holes 0.5 mm diameter with 1 mm spacing.
Fig 13. Printed-circuit board thermal via pattern.
03ag36
PAD1
PAD2
PAD3
R
th j
pcb
–
(
)
T
------------------------------
K W
T
V
F
I
×
(
)
=
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIP202-12M-2 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DC-to-DC converter powertrain
PIP202-12M-2 /T3 功能描述:直流/直流開(kāi)關(guān)轉(zhuǎn)換器 TAPE7 MOSFET RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開(kāi)關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT
PIP202-12M-2,518 功能描述:直流/直流開(kāi)關(guān)調(diào)節(jié)器 TAPE7 MOSFET RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開(kāi)關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
PIP20-5,08 功能描述:可插拔接線端子 PCB Hdr, 45 Deg, 5,08 PitchClosed End,20pole,12A,300V,Grn RoHS:否 制造商:Phoenix Contact 產(chǎn)品:Plugs 系列:PTS 端接類型:Spring Cage 位置/觸點(diǎn)數(shù)量:5 線規(guī)量程:26-14 節(jié)距:5 mm 電流額定值:10 A 電壓額定值:250 V 安裝風(fēng)格: 安裝角: 觸點(diǎn)電鍍:
PIP206 制造商:SENSITRON 制造商全稱:Sensitron 功能描述:Transient Voltage Suppressor, Unidirectional
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