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鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | PIC18F67K90-I/PTRSL |
| 寤犲晢锛� | Microchip Technology |
| 鏂囦欢闋佹暩(sh霉)锛� | 79/110闋� |
| 鏂囦欢澶у皬锛� | 0K |
| 鎻忚堪锛� | MCU PIC 128K FLASH XLP 64TQFP |
| 鐢㈠搧鍩硅〒妯″锛� | 8-bit PIC® Microcontroller Portfolio |
| 妯欐簴鍖呰锛� | 160 |
| 绯诲垪锛� | PIC® XLP™ 18F |
| 鏍稿績铏曠悊鍣細 | PIC |
| 鑺珨灏哄锛� | 8-浣� |
| 閫熷害锛� | 64MHz |
| 閫ｉ€氭€э細 | I²C锛孡IN锛孲PI锛孶ART/USART |
| 澶栧湇瑷倷锛� | 娆犲妾㈡脯/寰╀綅锛孡CD锛孭OR锛孭WM锛學DT |
| 杓稿叆/杓稿嚭鏁�(sh霉)锛� | 53 |
| 绋嬪簭瀛樺劜鍣ㄥ閲忥細 | 128KB锛�64K x 16锛� |
| 绋嬪簭瀛樺劜鍣ㄩ鍨嬶細 | 闁冨瓨 |
| EEPROM 澶�?銆�?/td> | 1K x 8 |
| RAM 瀹归噺锛� | 4K x 8 |
| 闆诲 - 闆绘簮 (Vcc/Vdd)锛� | 1.8 V ~ 5.5 V |
| 鏁�(sh霉)鎿�(j霉)杞夋彌鍣細 | A/D 16x12b |
| 鎸暕鍣ㄥ瀷锛� | 鍏ч儴 |
| 宸ヤ綔婧害锛� | -40°C ~ 85°C |
| 灏佽/澶栨锛� | 64-TQFP |
| 鍖呰锛� | 鎵樼洡 |
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2010 Microchip Technology Inc.
Preliminary
DS39964B-page 525
PIC18F47J53 FAMILY
D025
(
IOSCB)
Module Differential Currents (
IWDT, IHLVD, IOSCB, IAD, IUSB)
Real-Time Clock/Calendar
with Low-Power Timer1
0.5
4.0
A
-40掳C
VDD = 2.15V,
VDDCORE = 10
F
Capacitor
PIC18FXXJ53
32.768 kHz(3), T1OSCEN = 1,
(SOSCSEL<1:0> = 01)
0.7
4.5
A
+25掳C
0.8
4.5
A
+60掳C
0.9
4.5
A
+85掳C
0.6
4.5
A
-40掳C
VDD = 2.5V,
VDDCORE = 10
F
Capacitor
0.8
5.0
A
+25掳C
0.9
5.0
A
+60掳C
1.0
5.0
A
+85掳C
0.8
6.5
A
-40掳C
VDD = 3.3V,
VDDCORE = 10
F
Capacitor
1.0
6.5
A
+25掳C
1.1
8.0
A
+60掳C
1.3
8.0
A
+85掳C
31.2
DC Characteristics: Power-Down and Supply Current
PIC18F47J53 Family (Industrial) (Continued)
PIC18LF47J53 Family
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40掳C
TA +85掳C for industrial
PIC18F47J53 Family
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40掳C
TA +85掳C for industrial
Param
No.
Device
Typ
Max
Units
Conditions
Note 1:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 oscillator, BOR, etc.).
2:
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature,
also have an impact on the current consumption. All features that add delta current are disabled (USB module,
WDT, etc.). The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD/VSS;
MCLR = VDD; WDT disabled unless otherwise specified.
3:
Low-power Timer1 with standard, low-cost 32 kHz crystals have an operating temperature range of -10掳C to
+70掳C. Extended temperature crystals are available at a much higher cost.
4:
This is the module differential current when the USB module is enabled and clocked at 48 MHz, but with no USB
cable attached. When the USB cable is attached or data is being transmitted, the current consumption may be
much higher (see Section 23.6.4 鈥淯SB Transceiver Current Consumption鈥�). During USB Suspend mode
(USBEN = 1, SUSPND = 1, bus in Idle state), the USB module current will be dominated by the D+ or D- pull-up
resistor. The integrated pull-up resistors use 鈥渞esistor switching鈥� according to the resistor_ecn supplement to
the USB 2.0 Specifications, and therefore, may be as low as 900
during Idle conditions.
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鐩搁棞浠ｇ悊鍟�/鎶€琛撳弮鏁�(sh霉) |
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