- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3862 > PIC18F45J11-I/PT (Microchip Technology)IC PIC MCU FLASH 32KB 44-TQFP PDF資料下載
參數(shù)資料
| 型號： | PIC18F45J11-I/PT |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 180/228頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PIC MCU FLASH 32KB 44-TQFP |
| 產(chǎn)品培訓(xùn)模塊： | XLP Deep Sleep Mode PIC18 J Series MCU Overview 8-bit PIC® Microcontroller Portfolio |
| 標(biāo)準(zhǔn)包裝： | 160 |
| 系列： | PIC® XLP™ 18F |
| 核心處理器： | PIC |
| 芯體尺寸： | 8-位 |
| 速度： | 48MHz |
| 連通性： | I²C，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復(fù)位，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 34 |
| 程序存儲器容量： | 32KB（16K x 16） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 3.8K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.15 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 13x10b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 44-TQFP |
| 包裝： | 托盤 |
| 產(chǎn)品目錄頁面： | 657 (CN2011-ZH PDF) |
| 配用： | AC164322-ND - MODULE SOCKET MPLAB PM3 28/44QFN |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁當(dāng)前第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁第193頁第194頁第195頁第196頁第197頁第198頁第199頁第200頁第201頁第202頁第203頁第204頁第205頁第206頁第207頁第208頁第209頁第210頁第211頁第212頁第213頁第214頁第215頁第216頁第217頁第218頁第219頁第220頁第221頁第222頁第223頁第224頁第225頁第226頁第227頁第228頁
2011 Microchip Technology Inc.
DS39932D-page 55
PIC18F46J11 FAMILY
On devices that support it, the Deep Sleep mode is
entered by:
Setting the REGSLP (WDTCON<7>) bit (the
default state on device Reset)
Clearing the IDLEN bit (the default state on device
Reset)
Setting the DSEN bit (DSCONH<7>)
Executing the SLEEP instruction immediately after
setting DSEN (no delay in between)
In order to minimize the possibility of inadvertently enter-
ing Deep Sleep, the DSEN bit is cleared in hardware
two instruction cycles after having been set. Therefore,
in order to enter Deep Sleep, the SLEEP instruction must
be executed in the immediate instruction cycle after set-
ting DSEN. If DSEN is not set when Sleep is executed,
the device will enter conventional Sleep mode instead.
During Deep Sleep, the core logic circuitry of the
microcontroller is powered down to reduce leakage
current. Therefore, most peripherals and functions of
the microcontroller become unavailable during Deep
Sleep. However, a few specific peripherals and func-
tions are powered directly from the VDD supply rail of
the microcontroller, and therefore, can continue to
function in Deep Sleep.
Entering Deep Sleep mode clears the DSWAKEL regis-
ter. However, if the Real-Time Clock and Calendar
(RTCC) is enabled prior to entering Deep Sleep, it will
continue to operate uninterrupted.
The device has dedicated low-power Brown-out Reset
(DSBOR) and Watchdog Timer Reset (DSWDT) for
monitoring voltage and time-out events in Deep Sleep.
The DSBOR and DSWDT are independent of the stan-
dard BOR and WDT used with other power-managed
modes (Run, Idle and Sleep).
When a wake event occurs in Deep Sleep mode (by
MCLR Reset, RTCC alarm, INT0 interrupt, ULPWU or
DSWDT), the device will exit Deep Sleep mode and
perform a Power-on Reset (POR). When the device is
released from Reset, code execution will resume at the
device’s Reset vector.
4.6.1
PREPARING FOR DEEP SLEEP
Because VDDCORE could fall below the SRAM retention
voltage while in Deep Sleep mode, SRAM data could
be lost in Deep Sleep. Exiting Deep Sleep mode
causes a POR; as a result, most Special Function
Registers will reset to their default POR values.
Applications needing to save a small amount of data
throughout a Deep Sleep cycle can save the data to the
general purpose DSGPR0 and DSGPR1 registers. The
contents of these registers are preserved while the
device is in Deep Sleep, and will remain valid throughout
an entire Deep Sleep entry and wake-up sequence.
4.6.2
I/O PINS DURING DEEP SLEEP
During Deep Sleep, the general purpose I/O pins will
retain their previous states.
Pins that are configured as inputs (TRIS bit set) prior to
entry into Deep Sleep will remain high-impedance
during Deep Sleep.
Pins that are configured as outputs (TRIS bit clear)
prior to entry into Deep Sleep will remain as output pins
during Deep Sleep. While in this mode, they will drive
the output level determined by their corresponding LAT
bit at the time of entry into Deep Sleep.
When the device wakes back up, the I/O pin behavior
depends on the type of wake-up source.
If the device wakes back up by an RTCC alarm, INT0
interrupt, DSWDT or ULPWU event, all I/O pins will
continue to maintain their previous states, even after the
device has finished the POR sequence and is executing
application code again. Pins configured as inputs during
Deep Sleep will remain high-impedance, and pins con-
figured as outputs will continue to drive their previous
value.
After waking up, the TRIS and LAT registers will be
reset, but the I/O pins will still maintain their previous
states. If firmware modifies the TRIS and LAT values for
the I/O pins, they will not immediately go to the newly
configured states. Once the firmware clears the
RELEASE bit (DSCONL<0>), the I/O pins will be
“released”. This causes the I/O pins to take the states
configured by their respective TRIS and LAT bit values.
If the Deep Sleep BOR (DSBOR) circuit is enabled, and
VDD drops below the DSBOR and VDD rail POR thresh-
olds, the I/O pins will be immediately released similar to
clearing the RELEASE bit. All previous state informa-
tion will be lost, including the general purpose DSGPR0
and DSGPR1 contents. See Section 4.6.5 “Deep
for additional
details about this scenario.
If a MCLR Reset event occurs during Deep Sleep, the I/O
pins will also be released automatically, but in this case,
the DSGPR0 and DSGPR1 contents will remain valid.
In all other Deep Sleep wake-up cases, application
firmware needs to clear the RELEASE bit in order to
reconfigure the I/O pins.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PIC24HJ12GP201-I/SO | IC PIC MCU FLASH 12KB 18SOIC |
| DSPIC33FJ06GS102-I/SO | IC DSPIC MCU/DSP 6K 28-SOIC |
| PIC32MX220F032D-I/PT | IC MCU 32BIT 32KB FLASH 44TQFP |
| SFW9R-2STE1 | SFW9R-2STE1-FFC/FPC CONN |
| SFW5R-1STE1 | SFW5R-1STE1-FFC/FPC CONN |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PIC18F45J11T-I/ML | 功能描述:8位微控制器 -MCU 32KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC18F45J11T-I/PT | 功能描述:8位微控制器 -MCU 32KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC18F45J50-I/ML | 功能描述:8位微控制器 -MCU Full Spd USB 32KB 4KBRAM nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC18F45J50-I/PT | 功能描述:8位微控制器 -MCU Full Spd USB 32KB 4KBRAM nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| PIC18F45J50T-I/ML | 功能描述:8位微控制器 -MCU Full Spd USB 32KB 4KBRAM nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。