
PIC16(L)F1512/3
DS41624B-page 304
Preliminary
2012 Microchip Technology Inc.
25.6
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C
TA +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA
Thermal Resistance Junction to Ambient
80
C/W
28-pin SOIC package
60
C/W
28-pin SPDIP package
90
C/W
28-pin SSOP package
27.5
C/W
28-pin UQFN package
TH02
JC
Thermal Resistance Junction to Case
24
C/W
28-pin SOIC package
31.4
C/W
28-pin SPDIP package
24
C/W
28-pin SSOP package
24
C/W
28-pin UQFN package
TH03
TJMAX
Maximum Junction Temperature
150
C
TH04
PD
Power Dissipation
—
W
PD = PINTERNAL + PI/O
TH05
PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD(1)
TH06
PI/O
I/O Power Dissipation
—
W
PI/O =
(IOL * VOL) + (IOH * (VDD - VOH))
TH07
PDER
Derated Power
—
W
PDER = PDMAX (TJ - TA)/
JA(2)
Legend:
TBD = To Be Determined
Note 1:
IDD is current to run the chip alone without driving any load on the output pins.
2:
TA = Ambient Temperature.
3:
TJ = Junction Temperature.