參數(shù)資料
型號： PIC16C621-20/SS
元件分類： 微控制器/微處理器
英文描述： 8-BIT, OTPROM, 20 MHz, RISC MICROCONTROLLER, PDSO20
封裝： 0.209 INCH, PLASTIC, MO-150, SSOP-20
文件頁數(shù)： 109/121頁
文件大小： 1202K
代理商： PIC16C621-20/SS
PIC16C62X
DS30235H-page 88
1999 Microchip Technology Inc.
12.3
DC CHARACTERISTICS: PIC16C62XA-04 (Commercial, Industrial, Extended)
PIC16C62XA-20 (Commercial, Industrial, Extended)
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
°C, unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1:
This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula: Ir = VDD/2Rext (mA) with Rext in k
.
5: The
current is the additional current consumed when this peripheral is enabled. This current should be added to the base
IDD or IPD measurement.
6: Commercial temperature range only.
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
–40
°C ≤ TA ≤ +85°C for industrial and
0
°C ≤ TA ≤ +70°C for commercial and
–40
°C ≤ TA ≤ +125°C for extended
Param
No.
Sym
Characteristic
Min
Typ Max Units
Conditions
D001
VDD
Supply Voltage
3.0
-
5.5
V
See Figures 12-1 through 12-5
D002
VDR
RAM Data Retention
Voltage (Note 1)
–
1.5*
–
V
Device in SLEEP mode
D003
VPOR
VDD start voltage to
ensure Power-on Reset
–VSS
–
V
See section on power-on reset for details
D004
SVDD
VDD rise rate to ensure
Power-on Reset
0.05*
–
V/ms
See section on power-on reset for details
D005
VBOR
Brown-out Detect Voltage
3.7
4.0
4.35
V
BOREN configuration bit is cleared
D010
IDD
Supply Current (Note 2, 4)
–
1.2
0.4
1.0
4.0
35
2.0
1.2
2.0
6.0
7.0
70
mA
A
FOSC = 4 MHz, VDD = 5.5V, WDT disabled, XT
mode, (Note 4)*
FOSC = 4 MHz, VDD = 3.0V, WDT disabled, XT
mode, (Note 4)*
FOSC = 10 MHz, VDD = 3.0V, WDT disabled, HS
mode, (Note 6)
FOSC = 20 MHz, VDD = 4.5V, WDT disabled, HS
mode
FOSC = 20 MHz, VDD = 5.5V, WDT disabled*, HS
mode
FOSC = 32 kHz, VDD = 3.0V, WDT disabled, LP
mode
D020
IPD
Power Down Current (Note 3)
–
2.2
5.0
9.0
15
A
VDD = 3.0V
VDD = 4.5V*
VDD = 5.5V
VDD = 5.5V Extended Temp.
D022
D022A
D023
D023A
IWDT
IBOR
ICOMP
IVREF
WDT Current (Note 5)
Brown-out Reset Current (Note
5)
Comparator Current for each
Comparator (Note 5)
VREF Current (Note 5)
–
6.0
75
30
80
10
12
125
60
135
A
VDD = 4.0V
(125
°C)
BOD enabled, VDD = 5.0V
VDD = 4.0V
1A
FOSC
LP Oscillator Operating Frequency
RC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
0
—
200
4
20
kHz
MHz
All temperatures
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