參數(shù)資料
型號： PIC16C621-20/SS
元件分類： 微控制器/微處理器
英文描述： 8-BIT, OTPROM, 20 MHz, RISC MICROCONTROLLER, PDSO20
封裝： 0.209 INCH, PLASTIC, MO-150, SSOP-20
文件頁數(shù)： 108/121頁
文件大?。?/td> 1202K
代理商： PIC16C621-20/SS
1999 Microchip Technology Inc.
DS30235H-page 87
PIC16C62X
12.2
DC CHARACTERISTICS: PIC16LC62X-04 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
–40°C
≤ TA ≤ +85°C for industrial and
0°C
≤ TA ≤ +70°C for commercial and
–40°C
≤ TA ≤ +125°C for extended
Operating voltage VDD range as described in DC spec Table 12-1
Para
m
No.
Sym
Characteristic
Min
Typ Max Units
Conditions
D001
VDD
Supply Voltage
2.5
–
6.0
V
See Figures 12-1 through 12-5
D002
VDR
RAM Data Retention Voltage (Note 1)
–
1.5*
–
V
Device in SLEEP mode
D003
VPOR
VDD start voltage to
ensure Power-on Reset
–VSS
–
V
See section on Power-on Reset for details
D004
SVDD
VDD rise rate to ensure
Power-on Reset
0.05*
–
V/ms
See section on Power-on Reset for details
D005
VBOR
Brown-out Detect Voltage
3.7
4.0
4.3
V
BOREN configuration bit is cleared
D010
IDD
Supply Current (Note 2)
–
1.4
26
2.5
53
mA
A
FOSC = 2.0MHz, VDD = 3.0V, WDT dis-
abled, XT mode, (Note 4)
FOSC = 32kHz, VDD = 3.0V, WDT disabled,
LP mode
D020
IPD
Power Down Current (Note 3)
–
0.7
2
AVDD=3.0V, WDT disabled
D022
D022A
D023
D023A
IWDT
IBOR
ICOMP
IVREF
WDT Current (Note 5)
Brown-out Reset Current (Note 5)
Comparator Current for each
Comparator (Note 5)
VREF Current (Note 5)
–
6.0
350
15
425
100
300
A
VDD=3.0V
BOD enabled, VDD = 5.0V
VDD = 3.0V
1A
FOSC
LP Oscillator Operating Frequency
RC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
0
–
200
4
20
kHz
MHz
All temperatures
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
°C, unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1:
This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption. The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD to VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula: Ir = VDD/2Rext (mA) with Rext in k
.
5: The
current is the additional current consumed when this peripheral is enabled. This current should be added to the base
IDD or IPD measurement.
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