參數(shù)資料
型號(hào)： pentium II cpu
廠商： Intel Corp.
英文描述： Pentium II Processor AT 450MHZ(工作頻率450兆赫茲奔II處理器)
中文描述： 奔騰II處理器在450MHz（工作頻率450兆赫茲奔二處理器）
文件頁數(shù)： 69/84頁
文件大小： 1092K
代理商： PENTIUM II CPU
Pentium
II Processor at 350 MHz, 400 MHz, and 450 MHz
Datasheet
69
NOTE:
1. See Figure 45, label N.
6.2.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 225 grams. See
Section 4.0
and
Section
5.0
for details on the heatsink preformance requirements and processor weight.
6.2.3
Boxed Processor Retention Mechanism and Fan Heatsink Supports
The boxed processor requires processor retention mechanism(s) to secure the processor in the 242-
contact slot connector. S.E.C.C. processors must use either the retention mechanism described in
AP-588,
Mechanical and Assembly Technology for S.E.C. Cartridge Processors
(Order Number
243333), or retention mechanisms that have been designed to support S.E.C.C., S.E.C.C.2, and
Single Edge Processor Package (S.E.P.P.) form factors (also known as universal retention
mechanisms). S.E.C.C.2 processors must use either retention mechanisms described in AP-826,
Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages
(Order
Number 243748). The boxed processor will
not
ship with a retention mechanism. Motherboards
designed for use by system integrators
must
include retention mechanisms that support the
S.E.C.C. and S.E.C.C.2 form factors and the appropriate installation instructions.
Some boxed Pentium II processors using the S.E.C.C. packaging technology were shipped with fan
heatsink supports. These supports differ from supports for passive heatsinks. The boxed processor
fan heatsink support requires heatsink support holes in the motherboard. Location and size of these
holes are given in
Figure 44
.
Table 37. Boxed Processor Fan Heatsink Spatial Dimensions
Fig. Ref.
Label
Refers to
Figure
Dimensions (Inches)
Min
Typ
Max
A
Figure 39
S.E.C.C. Fan Heatsink Depth (off processor extended
thermal plate)
-
1.1
1.3
B
Figure 39
S.E.C.C. Fan Heatsink Height Above Motherboard
Note 1
0.5
-
C
Figure 40
S.E.C.C. Fan Heatsink Height
-
2.1
2.2
D
Figure 40
S.E.C.C. Fan Heatsink Width (plastic shroud only)
-
4.8
4.9
E
Figure 40
S.E.C.C. Power Cable Connector Location From Edge
of Fan Heatsink Shroud
1.3
-
1.45
F
Figure 41
S.E.C.C.2 Fan Heatsink Depth (off processor substrate)
-
1.3
1.4
G
Figure 41
S.E.C.C.2 Fan Heatsink Height Above Motherboard
0.4
0.6
-
H
Figure 42
S.E.C.C.2 Fan Heatsink Height
-
2.0
2.2
I
Figure 42
S.E.C.C.2 Fan Heatsink Width (plastic shroud only)
-
4.7
4.8
J
Figure 42
S.E.C.C.2 Power Cable Connector Location From Edge
of Fan Heatsink Shroud
1.4
-
1.45
K
Figure 43
Airflow keep out zones from end of fan heatsink
0.40
-
-
L
Figure 43
Airflow keepout zones from face of fan heatsink
0.20
-
-
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